Advanced Nonmetallic Carbon Product and Material Technologies for the Acquisition, Directional Transport and Dissipation of Thermal Energy
Industry Directory | Manufacturer
Precision analytical x-ray instrumentation for materials analysis in research, failure analysis, and quality control applications. Elemental and compound information at microscopic and macroscopic levels with x-ray microanalysis (EDS/WDS/EBSD) and x-ray fluorescence (EDXRF) products.
New Equipment | Design Services
The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat
- keyboards - touch displays - thermo printers - paper rolls - external dispalys - etc.
Electronics Forum | Wed Apr 19 11:54:32 EDT 2000 | Rudolf Niebling
You need a KIC profiler whitch is able to find optimal profiles for your boards. The KIC works very well with the Heller ovens. With the KIC is also possible to find one good profile for different boards. Get in contact with KIC +1-858-673-6050
Electronics Forum | Tue Apr 18 19:37:35 EDT 2000 | Russ Cutler
Let me be more specific about my dilema. We have used a vapor phase reflow process for many years. We just bought a Heller 1800 this year (2000). We may very well be able to run all 600 very different board types we build in 10 recipies on the Hel
Used SMT Equipment | Repair/Rework
This is a 1998 SRT Sierra Summit 1000 BGA Rework Station. Tested and calibrated to be in excellent working condition. Features the following: Computer with Windows 98 and networking capabilities. 6 Thermo-Couple Inputs. 4 Heat Nozzles. Micro
Used SMT Equipment | General Purpose Test & Measurement
Thermo Scientific PAL Accela Open Autosampler with software Includes: DLW injector system Keypad terminal Cool stack Temperature controller Vici Rheodyne multivalve assembly Elevated table Power supply Software
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2023-07-06 15:12:25.0
Equipment from a Custom Thick Film Hybrid Micro Electronics Manufacturer Clean Room, Assembly, Test & Inspection Equipment - Owner Retiring, Everything Must Go!
Parts & Supplies | Pick and Place/Feeders
Thermo Transfer Printer Zebra GX430t
Parts & Supplies | Pick and Place/Feeders
00384300-01 SIPLACE Maintenance Manager V1.0, consisting of SIPLACE Maintenance Manager and Maintenance Plan Builder, is an additional software package to SIPLACE Explorer. Both software modules are designed for visualization, observation, analyses a
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Live Demo of the SRT Sierra 1000 BGA Rework Station. Tune in, watch, learn and ask questions about BGA Rework Stations, BGA Rework Services, BGA Reballing and more! http://www.pcb-repair.com/bga-rework-station/
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Appleton, Wisconsin USA | Production,Quality Control
Job Responsibilities: Surface Mount Technology Corporation is seeking an experienced Process/Equipment Technician adept at the skills necessary to lead the continuous improvement process as related to machine performance and development efforts in p
Career Center | Appleton, Wisconsin USA | Production,Technical Support
Surface Mount Technology Corporation is seeking an experienced Process/Equipment Technician adept at the skills necessary to lead the continuous improvement process as related to machine performance and development efforts in preventative maintenance
Career Center | Brookfield, ALL USA | Management,Production
Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T
Career Center | , | 2011-11-16 09:17:11.0
Mil standards 464, Mil Standards 2000, ESD Training, Cellular Manufacturing, TQM Totally Quality Manufacturing, ISO 9000 and 9001 IPC Standards, IPCA-610, IPC-J-STD-001E, OSHA training, LEAN Manufacturing, JIT (Just In Time) Six Sigma, AS400 Systems
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
