Electronics Forum: thermomechanical (Page 1 of 1)

Re: Underfilled CSP mechanical test

Electronics Forum | Fri Jun 16 08:36:25 EDT 2000 | Paul Houston

We typically use air to air thermal cyling for thermo-mechanical testing. However, you may also want to look at vibration and drop tests. Basically you use the same tests for underfilled CSP's as you would for regular CSP's Paul CBAR Lab

Re: seeking low cost fix to tce mismatch

Electronics Forum | Thu Dec 30 21:22:12 EST 1999 | Jim

Mike, Thanks for the reply. It's not really a matter of slope. It is the long term thermomechanical fatigue that the solder joint undergoes as a result of repeated severe temperature swings, while the product is in use. Non-leaded parts are suscep

lead free platings and tin lead

Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN

I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f

BGA chip corner epoxy / adhesive?

Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef

We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi

Re: PCB Warping.

Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon

| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef

From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject

Re: PCB fab supplier supplier/evaluation

Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon

| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo

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