Electronics Forum | Wed May 26 06:59:10 EDT 2004 | davef
Some peelable solder masks attack immersion finishes. It appears components in the peelable soldermask, such as ammonia, are not very friendly to these particular surface finish. [We've wanted to investigate the effect of mask application thickness
Electronics Forum | Mon Apr 26 17:05:36 EDT 2004 | babe
If you have deep pockets and wish to spend alot of money over the next few years, then yes, call Metcal. Whatever solder iron you plan to use, it is my suggestion that you take a look at the board that you are going to solder. How big are the pads? H
Electronics Forum | Mon Jun 07 17:58:12 EDT 2004 | Rob
UPDATE: Just for fun... I sacrificed a scrapped board to determine what remained and what fell and this is the result. Board dimension was 18"x9" and .9" thick. Components consist of hundreds of passives plus 386 proc (QFP256), TSOPs, SOLs 14/16/20,
Electronics Forum | Tue Jun 29 13:42:20 EDT 2004 | sigmaprint
You will need to set the contact and squeegee zero calibration every time you set up a new product, we do this because the thickness of the substrate (pcb) can change between product and this will effect these calibration settings. The machine does n
Electronics Forum | Sat Jul 03 11:20:08 EDT 2004 | KEN
....not unique. But tough as hell! I build flex assemblies for a major P&P equipment manufacturer. Some are pure flex, most are ridgid flex. And of course, why put fiducials on the boards to help the process (why God, why me?) We use pallets and
Electronics Forum | Thu Jul 01 23:56:06 EDT 2004 | rsthompson
I'm having a philisophical discussion with my boss regarding long reflow soak times to improve soldering under BGA devices. Is there anything to be gained by extending soak times at the 150C level from 60-90 seconds to 5-10 minutes? I've never seen
Electronics Forum | Tue Jul 06 07:49:08 EDT 2004 | davef
Q1)What is the MSD level for PCB? A1) There is none Q2)I have some PCB's with HIC (humidity indicator card ) has turn to pink at 50%. Should I bake the PCB prior to assembly process.This fab is a complex board with various kind advance package assem
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Thu Oct 21 04:21:55 EDT 2004 | siverts
Have been through this before and we resolved our problem as follows: 1.Make sure that the length of your board support pins on Your HSP is correct. On that machine the board support pins depends on the board thickness (+ - some tenth's of a mm). It'
Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc
Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa
