Electronics Forum | Sat Aug 17 00:15:01 EDT 2002 | jojojameson
I also stick to Mr sams suggetion.wand is the best machine.we are using it for the last 3 years with out any single breakdown Regards JOJO JAMESON
Electronics Forum | Sat Aug 17 00:22:26 EDT 2002 | jojojameson
I also support sams suggetion.We are using WAND machine for the last 3 years with out any single breakdown Regards Jojo jameson
Electronics Forum | Thu Apr 11 12:10:14 EDT 2002 | jax
Different Solder types are not needed. Surface tension will hold most. Plenty of info in the archives about reflow profiles, weight limitations, etc...
Electronics Forum | Thu Apr 11 12:53:41 EDT 2002 | Winnie Chan
I was wondering what the water quality requirements are to wash PCBs? For example, the specific details including resistivity, pH, etc. In addition, can you also explain why DI is preferred? What is the scientific explanation behind that? Than
Electronics Forum | Thu Apr 18 20:48:25 EDT 2002 | ianchan
Hi, what model and make is your "Zero Ion Tester" (is that the brand make?)? Is yours a portable unit? who's the OEM supplier?
Electronics Forum | Fri Apr 19 11:11:59 EDT 2002 | dason_c
Zero Ion is from Aqueous Technologies. Check their web site, http://www.aqueoustech.com/Zero-Ion.htm.
Electronics Forum | Thu Apr 11 16:37:16 EDT 2002 | pteerink
Profile would be the first place I look. Check your rise and fall rates for temp. Should be no more than 2 deg/sec for rise and 4-6 deg/sec for cooling. Phil
Electronics Forum | Tue Apr 16 11:13:22 EDT 2002 | gzweig
In response to questions on BGA Process Requirements and X-ray Inspection please request pdf publication : "Rapid and Effective X-ray Inspection of BGA using Siganture Identification" from : gzweig@glenbrooktech.com
Electronics Forum | Tue Apr 16 14:40:06 EDT 2002 | jborrelli
We're currently brining up the BGA process. In instances where we needed to place a BGA for proto run, we subcontracted bga placement to a local organization, but its spendy. Would not want to use for production. We also intend to use an mpav.
Electronics Forum | Wed Apr 17 22:43:54 EDT 2002 | ianchan
what process is that? can kindly describe? is it that technology where bricks of solder are "ready made" deposit onto PCB pads thus eliminating the need to solder paste print/dispense by machine?