Electronics Forum: thread (Page 1721 of 7890)

Wire bonding on gold fingers

Electronics Forum | Thu Jul 03 11:36:57 EDT 2003 | Ron

Have you considered a temporary water washable solder mask. Elvaway solder mask tapes have been protecting Gold Fingers during soldering and simply wash away in a water wash process and leaves no residue.

Wire bonding on gold fingers

Electronics Forum | Mon Aug 02 11:21:29 EDT 2004 | sforman1

Use MicroCoat Technologies UV cure solder mask. will leave PCB absolutely clean. used in many PCB solder/wirebonding apps. http://www.m-coat.com

Wire bonding on gold fingers

Electronics Forum | Mon Aug 02 11:44:49 EDT 2004 | jbabson1

If you do wire bond before printing, Photo Stencil (www.photostencil.com)can help you design a stencil with relief on the pwb side for the wirebonding.

PCB Technology

Electronics Forum | Wed Jun 25 06:50:23 EDT 2003 | emeto

HI all, Can anyone give me more information or good www for PCB Technology. I am interested in materials for PCB's materials for pads, methods for making PCB, advantages and disadvantiges of the materials, which are now the leading technologies and i

PCB Technology

Electronics Forum | Wed Jun 25 09:10:51 EDT 2003 | davef

Coombs' Printed Circuits Handbook; Clyde F. Coombs; McGraw-Hill Professional; 5th edition; 2001; ISBN: 0071350160

BGA with gold corner / reflow problems

Electronics Forum | Wed Jun 25 11:06:35 EDT 2003 | James

Does anyone else have the same problem with BGAs that have a gold corner. It looks like the area where the gold corner is, it does not want to reflow proberly but the rest of the BGA reflows fine. Any suggestions????

SMT device shelf Life

Electronics Forum | Wed Jun 25 11:53:01 EDT 2003 | gmurray

Does anyone have a listing of recommended usage requirements on SMT components. Can you use SMT resistors which are over 3 years old for example ? Can you use ICs which are not known to be moisture sensitive but which are over 5 years old.

Flip Chip Underfil process

Electronics Forum | Thu Jun 26 07:20:09 EDT 2003 | emeto

Hello, What are the ways of placing underfill material under the flip chip.I read about dispensing from one side and dispensing from 2 sides. There must be other ways and I suppose some of you know them.I will appreciate any knowledge on the subject

OSP Handling

Electronics Forum | Thu Jun 26 13:04:33 EDT 2003 | mderen

What are the handling requirments for PCB's coated with OSP? Also do most solder paste work the same with OSP or do I need to use a certain paste type?

SMT machines obsolescence

Electronics Forum | Thu Jun 26 14:03:26 EDT 2003 | cristiano

I am looking for information about SMT machines obsolescence face to new types of components packaging like BGA�s and flip chips 0201 chips and others. I want to begin a study about industry trends that will help us to define what kind of equipment


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