Electronics Forum | Wed Feb 02 01:20:30 EST 2005 | sg2004
Anyone can let me know what is the difference between UP3000 and UP3030 in features? And, if possible, let me know all standard features of UP3030. I couldn't find any standard spec on the web. Thanks.
Electronics Forum | Fri Feb 04 11:43:53 EST 2005 | fastek
Yes...a UP-3030 will come with the automatic pin placement system and also 3D inspection. It's a fully optioned out UP-3000 basically.
Electronics Forum | Wed Feb 02 08:39:33 EST 2005 | David N Nadel
Looking for non magnetic 1% surface mount resistors. Does anyone have a clue where to find them?
Electronics Forum | Thu Feb 03 10:01:08 EST 2005 | Philj
Try heating a blank board on a hotplate to 183 deg C. with a board this thick, if the layer construction is poorly balanced, it may bend enough in the region of the ceramic capacitor for the soldered joints to crack it on cooling to ambient.
Electronics Forum | Sat Feb 05 13:25:32 EST 2005 | etienne
Just a basic suggestion.... Inspect the nozzle placing the component...because that is the only medium, apart from the PCB design, which can be causing the damage. It occurred in my Department.
Electronics Forum | Wed Feb 02 10:51:22 EST 2005 | aj
Hi, We are considering/hoping to upgrade from MCS to Fuji Flexa. Obviously the latter is the way to go but could any current users advise pro's and con's and capabilities on Fuji Flexa. Cheers, Alan
Electronics Forum | Wed Feb 02 13:36:27 EST 2005 | John S
170C) would be required for a lead free process. Can anyone comment on whether that is necessary or just conservative? Thanks John S
Electronics Forum | Wed Feb 02 18:01:22 EST 2005 | russ
I would call it conservative, but definitely recommended. It sort of depends on your assembly design. We have run 140 boards lead free but are now using the 170. Russ
Electronics Forum | Thu Feb 24 22:21:48 EST 2005 | davef
Here is an interesting article that supports T2s comments about Td: http://pcdandm.com/pcdmag/mag/0502/0502mcgrath.pdf
Electronics Forum | Mon Mar 07 15:35:35 EST 2005 | John M
It has been my experience that the standard Fr4 material (Tg 135c) will discolor when processed at the new higher temperatures required for the high tin alloys... We have been using the High Tg Fr4 (Tg 170c) for many years to ensure this does not hap
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