Electronics Forum | Mon Apr 04 17:27:48 EDT 2016 | dyoungquist
Lead nozzles last longer than lead-free nozzles. Our lead-free nozzles typically last 9-12 months but we are only running an average of 15 hours per week on a RPS Rhythm system using SN100C solder.
Electronics Forum | Tue Apr 05 08:37:16 EDT 2016 | duoman
I'm normally running 8 hours a day M-F, and an infrequent Saturday. My nozzles are from Pentagon EMS.
Electronics Forum | Thu Dec 01 10:36:59 EST 2016 | pjchonis
Hello. A-Tek is the distributor for EBSO Selective Soldering machines. If you could provide me with your serial number and contact information I can have one of our service engineers contact you for support. My email is patty@atekllc.com
Electronics Forum | Thu Dec 01 10:40:51 EST 2016 | pjchonis
Hello - A-Tek is the distributor for the EBSO equipment. You can reach technical support at 970-532-5100.
Electronics Forum | Tue Apr 12 19:22:44 EDT 2016 | szs0080
Hello, I did drop testing of some sample boards which had 15mm SAC105&305 BGA's on them. I polished them real nice and looked it under optical microscope for cracks. Was wondering the etching procedure before looking it under SEM. Thanks
Electronics Forum | Tue Apr 12 20:46:50 EDT 2016 | davef
IPC-TM-650 Test Methods Manual, 2.1.1 Subject Microsectioning, Manual and Semi or Automatic Method [ https://www.ipc.org/TM/2-1-01F.pdf ]
Electronics Forum | Wed Apr 13 17:19:44 EDT 2016 | davef
Formation and Growth of Intermetallics at the Interface Between Lead-free Solders and Copper Substrates [ http://www.boulder.nist.gov/div853/Publication%20files/NIST_Apex94_Siewert.pdf ]
Electronics Forum | Thu Apr 14 09:45:58 EDT 2016 | emeto
Why don't you fix the PCB flatness instead? If that is not the problem, I will check the part warping during the reflow process.If the part is large as you mentioned, it probably warps a lot during reflow. Try to bake the parts in front,based on MSL
Electronics Forum | Thu Apr 14 09:47:46 EDT 2016 | emeto
You can also try different paste from what you are using(may be paste with lower melting point).
Electronics Forum | Mon Apr 25 09:15:18 EDT 2016 | soldertools
Hi Adamjs! Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. For more details visit us at Soldertools.net
