Electronics Forum: thread (Page 4901 of 7929)

Problem with Ekra x5 Printer

Electronics Forum | Thu Feb 12 17:07:19 EST 2015 | magan

i found out what was the issue. driver card was bad so, that needs to be replaced. Thanks for support but i still need 'ekra x5' manual if someone carry, please email me. every day& now some other thing needs replacement and for technical understan

Oven profiles. Linear vs. Saddle?

Electronics Forum | Tue Sep 30 12:16:23 EDT 2014 | tech1

Check your pad sizes against the supplier recommendation. I have noticed that these LED packages are very light and easily move around during reflow. Human nature has us checking the profile and making changes when in fact it is usually something els

Oven profiles. Linear vs. Saddle?

Electronics Forum | Fri Oct 03 10:23:29 EDT 2014 | emeto

1. Pad design. Most of the tombstones are result of wrong pad(land) design. One pad is significantly bigger than the other or the metal laying under one side of the part is much more than under the other side. 2. Part placement - should be in the ce

Machine down

Electronics Forum | Mon Sep 29 13:36:01 EDT 2014 | dustin

I came into work this morning to an error on one of my printers. After powering on machine, the error MACHINE DOWN popped up in the top left corner of the screen. I have the giant manual and could not locate a solution for this error. I have checked

SMD Via hole design-thermal performance

Electronics Forum | Fri Oct 31 09:26:08 EDT 2014 | rgduval

I do not recommend ever leaving the top of a via-in-pad open. Cap the via in the pad. Leaving it open for "solder to stuff the hole" causes issues in assembly, notably insufficient solder due to vampirism (the solder wicks into the via, rather than

SMD Via hole design-thermal performance

Electronics Forum | Wed Jul 15 18:04:43 EDT 2015 | mikekeens

If it is important to have vias within thermal pads to help dissipate heat i would recommend using solder mask to stop the solder from wicking down the holes and resulting in insufficient solder. Some further info can be found here:- http://www.surf

warpage after reflow

Electronics Forum | Tue Oct 07 22:15:12 EDT 2014 | padawanlinuxero

How to avoid /reduce warpage in long length PCB & > _1.6MM THICK PCB. You need to put it in a fixture or pallet to run it in the reflow oven, most common material use here is durostone for the pallets that we run in the reflow oven, we use Durosto

Philips Topaz/Emerald LED Nozzle

Electronics Forum | Tue Oct 21 05:28:37 EDT 2014 | rob

Hi Emanuel, Chingyi do quite a wide selection of rubber tipped nozzles http://www.chingyi.com.sg/solutions_smt.php If you are in Europe, then Wilfred @ Europe-SMT knows these machines better than most: http://www.europe-smt.com/ Our personal favo

Wave Solder issues

Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist

Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.

Flying Probe

Electronics Forum | Wed Oct 15 23:49:42 EDT 2014 | padawanlinuxero

Rob, I couldn't write it better, really sometimes we mess up a pristine surface mounted pcb with the nasty ol'flux, but anyway a flying probe is that a set of needles touching a pristine surface of a pcb, to test different components, try in youtube


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