Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
Electronics Forum | Wed Jan 19 11:37:18 EST 2000 | Mark D. Milward
Does anyone consider the use of a Cyberoptics LSM solder paste thickness measurement system to be a valid test in determining the viscosity of solder paste. This procedure was proposed as an alternative to using the Malcolm gage for viscosity testing
Electronics Forum | Thu Jan 20 15:11:26 EST 2000 | Russ
I tested out the OK unit and found it to be a "down and dirty" rework machine that will do BGAs if demeanding thermal requirements are not needed. My largest concern was the lack of bottom side preheat. I have recently purchased the Air-Vac DRS24 a
Electronics Forum | Thu Jan 20 15:47:39 EST 2000 | Kris W
Rob, I am currently using a BGA-3000 from OK, which works fairly well. I did find that the customer support for the purchase of nozzles and stencils was very poor (overpriced and long lead times). I did find stencils for a good price through Mini
Electronics Forum | Wed Jan 19 17:01:18 EST 2000 | Chad Notebaert
You can buy desicant packs and indicator cards to place back in the original or a new bag with the BGA's and re-seal using a heat sealer (Vac Seal being the best). If properly done the material will be kept below the 20% RH level. Another option woul
Electronics Forum | Mon Jan 17 21:05:30 EST 2000 | Dave F
Scott: I don't know anyone, but if I had to find one I'd start by trying to finagle leads from either of these guys: Electronics Representatives Association 444 N. Michigan Ave, Suite 1960 Chicago, IL 60611 312.527.3050 Fax 3783 info@era.org ... er
Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F
We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Wed Jan 19 22:28:20 EST 2000 | Dave F
Taking things from a slightly different angle: Cost of assembling various packages based on volume: C/R placement: |$0.01 to 0.04 per part SOIC: | $0.03 PLCC based on lead count: | 20-39 $0.16 | 40-59 $0.18 | 60-79 $0.20 | 80-
