Electronics Forum | Tue Aug 04 10:44:41 EDT 1998 | Chrys
| | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | Also, has any one
Electronics Forum | Fri Jul 31 11:55:23 EDT 1998 | Henrik Ljunggren
I am trying to obtain information on the US Heatsink market.I am trying to establish the top ten manufacturers, current trends, market shares etc Would anyone know where I could obtain such information ? I would appreciate any form of help. Best Rega
Electronics Forum | Thu Jul 30 11:00:19 EDT 1998 | Matt Harding
I have some potential unused SMT equipment which may be candidates for sale. Any input regarding the value or expected going rate would be appreciated. CONDITION: E - Excellent Condition F - Fair Condition G - Good Condition Equipment List: BRAND
Electronics Forum | Sun Aug 02 12:24:23 EDT 1998 | Bob Willis
Sorry all the parts I have processed are just like standard BGA just swing back into possition unless they are placed off the pads and touching the next pads. All my parts have had heat sinks and are the same weight as PBGA. Are your parts light. If
Electronics Forum | Mon Aug 03 12:18:42 EDT 1998 | John Sikes
We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several ru
Electronics Forum | Wed Jul 29 22:50:17 EDT 1998 | Dave F
| We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone ha
Electronics Forum | Wed Jul 29 04:03:15 EDT 1998 | Bob Willis
The Reflow Soldering Interactive Test was well received in the industry with over 200 engineers testing their process knowledge. Now its time to take the Wave Soldering challenge and test you knowledge on soldering through hole and surface mount. Bot
Electronics Forum | Tue Jul 28 14:34:47 EDT 1998 | upinder singh
Hello everybody. Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at the
Electronics Forum | Tue Jul 28 07:07:00 EDT 1998 | John Godfrey
I need to remove all flux splatters from our boards. We've adjusted the oven profiles with the production paste, but have not been able to eliminate the splatter. I've tested sample from several paste suppliers and have only been able to find 1 which
Electronics Forum | Sun Jul 26 20:56:43 EDT 1998 | Masdi Muhammad
We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the goldfinger during touch-up or rework and to reduce the contamination we are planning to implement 'tapin
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