Electronics Forum | Mon Mar 03 08:33:54 EST 2003 | msivigny
Hello bphillips, I'm not surprised you're having difficulties with this size chip. As technology advances in product development continue to shrink package and real-estate size, the equipment and its automation must continue to perform it's desired f
Electronics Forum | Mon Mar 03 09:16:09 EST 2003 | msivigny
Hello martys, The critical variables to measure print process capability on any printer are its ability to securely clamp a board, accurately align the board to its mating stencil, print with appropriate squeegee pressure and follow print material gu
Electronics Forum | Tue Mar 04 13:27:39 EST 2003 | MA/NY DDave
Hi Wow Genny, I don't think I could have given so much detail so fast. I have designed some high RF test designs for testing purposes to pass only the High Frequency, yet I didn't want to muddy the water with this other side. Now you did it well a
Electronics Forum | Tue Mar 04 15:04:52 EST 2003 | MA/NY DDave
Hi Just had to poke back at this one. Good article David F, Thanks!! A little old yet still great. Hey ever used Pease Porridge from EDN. Modelling has come a long way in a short while, yet still the real physical reality and the desired electro
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Mon Mar 03 11:49:15 EST 2003 | msivigny
Hello marys, To determine the quality performance specification of your printers, dispensers or placement equipment, you must first know the operational accuracy and repeatability criteria from the equipment manufacturer. Only then can you determine
Electronics Forum | Thu Mar 06 11:37:17 EST 2003 | msivigny
Hello Phil, sorry for the confusion, because of our level of defect control and tracking at each process step, we did not use AOI systems at the time. We had a manual inspection station after reflow, then ICT and Functional/Final test for each produc
Electronics Forum | Tue Mar 04 18:38:12 EST 2003 | ruggi
Most of what we do (across 800+ varieties) is bottom side first. In general, there really aren't any problems as long as our Customers follow the .25g/cm wetted lead perimeter spec for weight (which many don't), and don't mount tall components on th
Electronics Forum | Tue Mar 04 12:05:27 EST 2003 | ggspook
Thanks Mike Honestly the whole subject of repeatability is Is confusing i.e. I do perform placement tests using glass plate�s Fuji IP3 and Pam on the Fuji chip shooters which calibrate to 3 sigma but I cannot guarantee placement repeatability As y
Electronics Forum | Tue Apr 08 18:15:14 EDT 2003 | kent_peterson
Running the PAM board is a great tool. Using another machine to get you CPK is very inportant. We use the DT651 which does everything the PAM rom card does plus it gives a CP and CPK value. You can also use it to verify feeders in the X and Y. SMT re
