Electronics Forum: thread (Page 6741 of 7929)

Flux residue?

Electronics Forum | Wed Apr 30 20:33:15 EDT 2003 | davef

Haaaa!!!! Yes, we�ve seen things like that. We found that a high input impedance amplifier worked fine in a room with a controlled environment and worked poorly in the sweat-shop portion of our plant. We were using good ol� WS609, straight water w

Flex Circuits reflowing

Electronics Forum | Fri May 02 12:41:16 EDT 2003 | Chris Lampron

Hi Chris, I had worked for a flex circuit house for 10 years. You should be able to follow your solder paste guidelines for times and temps. You may want to consider pre-baking the flex if it is made with Kapton. Kapton is Hygroscopic and will delam

PCB Identification and Tracking

Electronics Forum | Tue May 06 09:38:41 EDT 2003 | blnorman

We use both labels and lasers to mark our boards. Since implementing the lasers, the downtime attributed to bar code labels on those lines have dropped to virtually nothing. We still have problems with the labels wrinkling during reflow making read

Standard kit in LVHM environment

Electronics Forum | Tue May 06 10:14:18 EDT 2003 | k_h

A typical machine will have around 100 feeder slots. Manufacturers use the slots differently though, use 8mm feeder counts as your basis. Siemens, for example has 40 slots but you can get 2 (or 3) 8mm's per slot giving you 80+ 8mm feeders, while a Sa

Standard kit in LVHM environment

Electronics Forum | Fri May 09 10:29:23 EDT 2003 | k_h

72 different part numbers, 53 being 8mm, remainder being 12-44mm and 3 tray. It may be low but anymore than 100 and you give up throughput because of feeder locations. And thinking about it, 70-90 is low for a low volume high mix line. I guess if I w

Standard kit in LVHM environment

Electronics Forum | Mon May 12 10:14:04 EDT 2003 | gregp

Hello Stefan, Thank you for your reply. I see now that manufacturers are aware that this kind of thought process is necessary for the bottom line profit. It is also true that one can be "seconds wise and minutes foolish" in the process. I read with

Void in CSP

Electronics Forum | Wed May 07 08:10:22 EDT 2003 | Pon

Hi all Are there any advice pls. let me know. Our customer Void spec. at BGA and CSP is less than 10%. Usually we found void defect at BGA and CSP component around 2-3 % but sone lot the defect rate is up to 18%. I have read some input from this w

Void in CSP

Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef

Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;

Component Overturn

Electronics Forum | Thu May 08 09:00:03 EDT 2003 | stefwitt

I like to find out more about your feeder manufacturer. Known problems: If the cover tape peel back is located in the pick up window, the tape may lift the component out of the pocket and when the component falls back it could be inverted. The co

UP2500 misregistration in one direction

Electronics Forum | Thu May 08 10:44:48 EDT 2003 | mark_susol

I am experiencing a problem with print misregistration only in one direction on our UP2500. When it prints from front to back I get perfect regsitration on micro BGAs, but on the second stroke moving back to front I get a misregistration in the strok


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