Electronics Forum | Thu Feb 24 21:44:27 EST 2000 | Dave F
Horace: Area you in the rainy or the dry portion of the South? ;-) Now, excuse me from mincing words with you ;-) �, but buying a manufacturing software package is a serious (expensive) endeavor that will leave no part of your company unscathed. I�d
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Wed Jul 26 10:06:19 EDT 2000 | Doug Philbrick
I have read many of the past threads on both topics and I still am not convinced I know the answer to the soldering problem we are encountering. I am hopping someone can help. I have a dense SMT board we are building and have been building for some
Electronics Forum | Tue Jun 06 14:05:22 EDT 2000 | Jeff Sanchez
Ray, I don't know for sure what exact data Ceeris used to come up with their figures. Did they account for shipping? Was the rework done by expensive equipment? When I read your thre
Electronics Forum | Fri May 19 11:20:12 EDT 2000 | John Thorup
Dave - well said ScottM - I'm appalled - Your management sounds like a throwback to an early industrial age where the workers were treated as a commodity. It's not right to do only what you're forced to do when protecting human beings and the enviro
Electronics Forum | Thu Feb 24 21:44:27 EST 2000 | Dave F
Horace: Area you in the rainy or the dry portion of the South? ;-) Now, excuse me from mincing words with you ;-) �, but buying a manufacturing software package is a serious (expensive) endeavor that will leave no part of your company unscathed. I�d
Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef
Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat
Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F
Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �
Electronics Forum | Thu Nov 04 23:45:16 EST 1999 | Jeff Sanchez
Hey Brian, We are not sure what it is you are referring too? If you feel they did not respond promptly than I am assuming that you picked up the phone and asked them what's up? Your thread just came across as bashing and a little negative, as
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