Electronics Forum: tombstoning (Page 31 of 66)

TOMBSTONE DEFECTS

Electronics Forum | Thu Mar 27 12:25:14 EST 2003 | kenlchin

additonally, minimizing the rising rate aroud 183'c and decrease the droping rate(near 0.8'c/s) is also a good way .

Tombstone defect

Electronics Forum | Thu May 01 17:49:33 EDT 2003 | jym2000

Did you check board orientation into the reflow oven? (The Layout components are the same products A & B?) Regards Jesus

Tombstone defect

Electronics Forum | Mon May 05 02:37:11 EDT 2003 | gaoliangcheng

Maybe you can check the thickness of the solder mask between the pads. If the highest of the solder mask exceed the pad,then the component which was placed will be unbalanced.

Tombstone defect

Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen

Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.

Tombstone defect

Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen

Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.

Tombstone defect

Electronics Forum | Mon May 05 09:53:13 EDT 2003 | k_h

Stencil thickness = 175 microns? If my math is correct, 175u=0.175mil, and if that is english units then it is inches. I'm not understanding this correctly, please clarify for my sake please, are you saying the stencil thickness is 0.000175 inches th

Tombstone defect

Electronics Forum | Mon May 05 12:16:07 EDT 2003 | russ

A micron is 1 millionth of a meter, this term is no longer used according to my dictionary. I would have to agree with the dictionary. Anyway, 175 microns is a little more than 6.8 mils. Russ

Tombstone defect

Electronics Forum | Tue May 06 05:02:42 EDT 2003 | Grant

Hi, Ok, thanks for the reply, and this is really interesting. I wonder if there are any good articles about this to read somewhere. Regards, Grant

Tombstone defect

Electronics Forum | Tue May 06 06:29:06 EDT 2003 | yukim

Hi, No, the layout is different, but both have chips located arallel and perpendicularly to the flow direction. And we do have defects in both orientation. What about the PCB warpage? Sometimes we find warped PCBs. Could this affect? Thanks, Yu.

Tombstone defect

Electronics Forum | Tue May 06 22:31:52 EDT 2003 | yukim

Yes, we did try: built a lot of 200 PCBs with Sn62Ag2 solder paste (we have been using Sn63) and it helped, but not eliminated the problem.


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