Electronics Forum | Fri Mar 20 10:28:52 EDT 2015 | g2garyg2
PROMATION also offers Table Top hot iron systems for this type of application.
Electronics Forum | Thu Sep 08 15:17:08 EDT 2016 | bobpan
black on top / blue on bottom both sides good luck
Electronics Forum | Tue Apr 11 07:59:24 EDT 2017 | highmillr
Top plate is secure. No abnormal lights in I/O.
Electronics Forum | Thu Jul 27 10:45:12 EDT 2017 | georgetruitt
Does the Mirtec inspect the solder joints top/bottom of the through hole as well as the color value?
Electronics Forum | Wed Dec 12 08:45:02 EST 2018 | msbettyhunt
Can you please share top PCB manufacturers in USA?
Electronics Forum | Fri Feb 21 10:59:15 EST 2020 | slthomas
I used to work for an OEM that made professional audio equipment (studio monitors, mixing boards, etc.). The mixers required precise alignment of LEDs, switches, and pots in the sheet metal so we used aluminum alignment fixtures during wave solder. T
Electronics Forum | Thu Dec 09 12:29:39 EST 2021 | stephendo
With the bottom followed by the top set up, how do you even come close to balancing that? For a lot of boards that I have seen you would need five or more top lines just to handle one bottom line. Or have the bottom line on a very low duty cycle. B
Electronics Forum | Thu Oct 12 12:59:06 EDT 2000 | jackofalltrades
Does anyone know of a manufacturer of a Small Bench Top Convection Oven that could be used to reball BGAs? Right now we use Winslow Preforms and an Air-Vac DRS24 or our reflow ovens, but this ties them up too much and I'd like to keep reballing seper
Electronics Forum | Wed May 03 10:18:43 EDT 2000 | Stefan Witte
Greg, at least on three different brand machines, I was working on, the offsets rotated with the board. If you start out at 0 deg. and the offset in the top left corner than it is on top right at 90 deg., bottem right at 180 deg. and bottem left at 2
Electronics Forum | Wed Apr 26 06:43:21 EDT 2000 | Sal
Guys We currently produce a number of PCB's which are reflowed on the top side and glued on the bottom side, and the current process is to build the top side and reflow then glue and cure, is this approach correct ? or should we be curing then reflow
