Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Mon Aug 27 11:11:16 EDT 2012 | rway
We have 1/2 dozens 0.031 pcbs that bow after going through the oven. We are looking for a solution to this problem to prevent bowing of the pcbs. As a result of the bowing, the pcbs, on occasion get caught in the oven, and more often have transfer
Electronics Forum | Mon Sep 17 06:11:41 EDT 2012 | kq702
Hi I did a reflow on a laptop board and after the reflow the board is warped in the area I did the reflow in, and now the laptop screen does not turn on at all when I put it back into the laptop. Original problem was the wifi (I did the reflow more o
Electronics Forum | Thu Aug 27 11:18:05 EDT 2015 | dyoungquist
From your description I am assuming you are doing double sided reflow and parts are dropping off the bottom side when the board is run through the reflow oven the second time. A few ideas to try: 1) Are the parts that are dropping off heavier parts
Electronics Forum | Tue Jul 25 16:08:52 EDT 2017 | dontfeedphils
I'm currently working on bringing a manual coating process/workcenter online and my QA team is giving me some grief. For background, we're using Humiseal 1B31 thinned with thinner 521, mixed at 1:1 by volume. Spraying through a Binks HVLP with 10 P
Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg
I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some
Electronics Forum | Tue Jun 25 12:10:10 EDT 2019 | slthomas
The profile (temperature curve) is absolutely a function of both top and bottom zone settings as well as conveyor speed, blower speed, etc.. Certainly when you perform profiling you have to consider both top and bottom heaters when you make adjust
Electronics Forum | Mon Aug 10 22:18:02 EDT 1998 | Steve Gregory
I am trying to get an idea of what system seems to work best for >solder paste inspection. I am looking for basic table top >models with he capabilites of height and width measurements. >Can anyone give me suggestions, pricing and why you prefer on
Electronics Forum | Wed Apr 12 22:26:08 EDT 2000 | Alberto Hern�ndez
Hi Kevin!!! I have worked with both sides boards in 3 differents ways: a)Glue-Solder paste- Manual assembly- Wave soldering For the bottom side we placed glue dot in the board then we placed parts and finally the convection reflow at 150�C each zone
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