Electronics Forum | Fri Aug 06 11:07:49 EDT 2004 | JB
"I thought it was purely a mechanical up-down movement with the cam and hence the thickness hardly has any effect!" It is purely mechanical.On our high speed turret the machine knows the distance between the tip of the nozzle and the top surface of
Electronics Forum | Sat Aug 14 08:43:17 EDT 2004 | davef
Russ makes good points. Your printer supplier can give good advice on machine setup also. We know we're printing well when: * Paste at least as big in diameter as your thumb is rolling across the stencil * Paste is filling the apertures * Squeegee
Electronics Forum | Wed Aug 18 10:34:35 EDT 2004 | russ
We do this every day, We print the bottom side, then the top, and have a tool that presses the connector on. We then process the board down the line. The only tricky thing is keeping fingers out of paste. Fortunately this is a single sided board.
Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc
Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa
Electronics Forum | Thu Sep 02 16:47:08 EDT 2004 | Irun
Hi all I have a question about DI water for cleaning system. What water quality should ionic exchanger produce for assembly cleaning (SMD and THT components with BGA and microwave application). What is recommend water conduction and minimal level (0.
Electronics Forum | Tue Sep 14 16:09:50 EDT 2004 | HOSS
Adam, Is your fluxer giving you good coverage into the holes and to the top of the board? If your hole size in relation to the lead diameter is too small, this may be contributing. I'd check your fluxing first though. Just an aside.....We just sw
Electronics Forum | Wed Sep 15 17:50:24 EDT 2004 | GS
Hi Simon, do not forget BGA have more surface contact ( qty off balls) then a same size of QFP. I mean, theoretically unless the BGA is very heavy, it is more simple to solder mirrored PBGA then try to have QFP on bottom side to be soldered. Are ple
Electronics Forum | Thu Sep 16 07:07:34 EDT 2004 | C Lampron
Hello Chris, "It sticks up about 3/8" or so above the surface of the board." Is this over the ridgid portion of the PCB or in between? Is it possible to create a support fixture for printing that has relief that will allow the flex to bow downward i
Electronics Forum | Sat Sep 25 10:36:06 EDT 2004 | gpaelmo
Hi, Anyone using this in production? Our company is looking into this model (used). Board size up to to 8"x10", max layer=12, single and double side SMT, medium density mostly passives, max QFP/BGA on board=7-10, 1,000-3,000 boards/wk. Can anyone d
Electronics Forum | Mon Oct 18 12:02:06 EDT 2004 | Rob
Hi Guy's, Sorry about this, but yes it's another lead free related question. We are looking at using a Chinese SMD DC-DC Converter in a new design, whilst keeping one eye on the approaching Lead-free issue. The manufacturer claims that these are O
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