Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Wed May 20 16:07:22 EDT 2020 | stephendo
You want a big enough storage tank to smooth pressure. Figure out what size pipes you need and go a size bigger. Make a loop of the pipes with shut offs. That way you can shut down any section and still have air to the rest of the air line. Run the p
Electronics Forum | Wed Sep 29 08:26:03 EDT 2010 | babe7362000
We are Currently running a Board and it seems that the SOT-223's on the bottom side have flux and water trapped under the part. Nothing has changed in our process and this is the only board that it is happening on. We are using Kester R562 water wa
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