Electronics Forum | Wed Jun 25 12:08:53 EDT 2003 | russ
I battle this all the time, I don't believe that it is the "gold corner" that is causing the problem but something with the PCB layer makeup (copper planes, or bottom side components, etc.). It could also be the nozzle you are using has a "hot spot/
Electronics Forum | Wed Jul 09 10:55:51 EDT 2003 | Veronica
Hi Reman01, I have done that before when I was in Motorola. What kind of ball are you trying to repair? How many pieces of BGA chip do you need to repair a day? If it is not too many, you can do it by yourself. It is a lot, such as 100 to 1000 piece
Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas
Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on
Electronics Forum | Tue Aug 05 12:05:15 EDT 2003 | mleber
Through hole question - what methods can be used to obtain upflow on multi layer pwbs with huge ground planes. We are using a water soluble flux with a max temp of 220 topside. I am pushing the limits of the flux and hitting 250 topside in an attempt
Electronics Forum | Tue Aug 05 21:18:24 EDT 2003 | cardinal
Hi, One thing you might want to do has to deal with the venting over the top of your spray fluxer. Many times the exhaust comes from the side; instead of directly inline on top of the spray fluxer. This will draw the flux up the thru-hole joints m
Electronics Forum | Thu Aug 14 16:36:45 EDT 2003 | Hussman
Anyone using these 2010 resistors? We just tried them and they bow like crazy during reflow. Not very good looking. Profile meets manufacturers spec. The part solders and works fine, but I'm a little concerned about putting anything on a board th
Electronics Forum | Wed Aug 20 21:30:56 EDT 2003 | paulm
Our company if currently reviewing our BGA Screen Printing Process. The problem we are trying to eliminate has to do with BGA Ball Size Variance. Some of our vendors are allowing a +/- of 0.004" in ball size. This would allow for the possibility of a
Electronics Forum | Fri Aug 22 11:34:32 EDT 2003 | Stephen
Don't forget moisture senitive devices. If you have them on the bottom side, usually you do the other side before it is an issue, but if you are going to store the boards for a while it could be an issue. Where I am, partially building product then
Electronics Forum | Fri Aug 22 23:17:22 EDT 2003 | Hoss
Mike, Any chance these parts have been sitting around esposed to your factory's ambient conditions, not in a vacuum sealed bag or dry box? If they haven't, you may have parts with a high moisture content which could cause "potato chipping" you desc
Electronics Forum | Fri Aug 29 05:48:57 EDT 2003 | russells
Can anyone help? We need a PCB material capable of working at 200 deg C, we are currently using Norplex P95 but we are being stung with huge minimum order quantites as we are in the uk and all the manufacturers have to buy it in on special order. Doe
