Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason
We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F
0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would
Electronics Forum | Mon Jun 12 10:57:51 EDT 2000 | Jason
I am new to wave soldering. Any information is greatly welcomed. Here is the problem. After soldering the boards they have a film on the bottom of them and sometimes a white powder looking substance. I have tried decreasing the amount of flux on
Electronics Forum | Tue Jun 06 20:10:28 EDT 2000 | Dave F
You bet. It goes liquidous and tries to flow down hill flux or not. * And wudda wanna bet there�s still flux residues in those vias, anyhoo? Yes, you're right!! There might be excess flux residues in them via barrels....but why
Electronics Forum | Tue May 30 09:52:21 EDT 2000 | Sal
Problems with dry joints on a 184 pin Berg connector with locating pins.Using a 0.005"screen, on a n-tek finished board and using Nitrogen. The problem is really intermittent.We tryed using a variety of placement forces using our siemens F5. The comp
Electronics Forum | Tue May 23 20:37:22 EDT 2000 | Dave F
Gabby: Trying to avoid accusations of plowing new ground eh? Inert soldering: R Curthers et al, "Optimizing A No-Clean Circuit Board Process Using Nitrogen Inerting In A Conventional Wave Solder Machine," NEPCON West 1991 T Walsh, "The benefits Of
Electronics Forum | Tue May 23 11:06:53 EDT 2000 | Michael Parker
Kathy- Greater than 88%. Is that 3-D Nicolet? I had a conversation with Arline yesterday, she told me about your trials and tribulations with re-balling. I would like to suggest you try micro-stencil instead. If your BGA rework center has the capabi
Electronics Forum | Thu May 18 20:47:14 EDT 2000 | Dave F
Ed: It might be possible, never tried tho, but if an engineer wandered in, talking about it ... Printing: Makes me pretty nervous, because punched boards are not planar, don�t stay planar, and are inconsistently not planar. If I could work-out th
Electronics Forum | Thu May 18 08:32:02 EDT 2000 | Nancy V
Janet, I like Dave's advice. I would send you first to www.smtmag.com They have articles there that give the basics of SMT. Look for the button that says "Step-By-Step SMT." It will give you a touch of what your in for. Then find a good book. I
