Electronics Forum: tri (Page 836 of 944)

Re: contamination problem on boards after wave soldering

Electronics Forum | Wed Jun 17 16:19:10 EDT 1998 | Ryan Jennens

| We are facing a problem of high contamination on boards after wave soldering. We want the contamination to be under 24 ugm/inch square. We are using a no clean flux with the spray fluxer unit of wave soldering. The contamination is higher on the e

Re: Lemme' re-phrase that

Electronics Forum | Wed Jun 17 08:28:59 EDT 1998 | Dave F

| | Ben: Why not consider some of the training suggestions made by SMTNeter's to Marcos on the tread shown below? Dave F | | Looking for Training in SMT process - Marcos Silva 15:24:13 6/12/98 (7) | Dave- I did happen to look over those posts befor

Re: Siemens siplace for high mix/medium to low volume

Electronics Forum | Sat Jun 13 09:36:46 EDT 1998 | RNLM

| Is cost an issue? I evaluated Siemens Siplace about a year ago and the price per placement was twice what Phillips Machinery has to offer. We too are a high mix/low PCb count shop. Also, Siemens has many hidden costs and the references I talked

Re: Hot-Air Leveling. / Earl You Chicken

Electronics Forum | Tue Jun 09 13:08:30 EDT 1998 | Earl Moon

| | | Hello, | | | Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at

Re: TCP solder / desolder / rework

Electronics Forum | Thu Jun 18 10:57:28 EDT 1998 | Mike Moninger

| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,

Re: Ionic chromotography test on PCBA/My Sympathies

Electronics Forum | Fri Jun 05 15:06:26 EDT 1998 | Dave F

| I have just been assigned to look into the ionic chromotograhy test on our PCBA but I have zero knowledge. Could anyone help to explain what is this test about? Is it | a) a destructive test? | b) What is the measurement unit of this test? | c) Wh

Re: Double sided smt

Electronics Forum | Wed Jun 03 13:50:32 EDT 1998 | Chrys

| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b

Re: Minimizing Board Warpage During Reflow

Electronics Forum | Wed Jun 03 09:04:19 EDT 1998 | Steve Gregory

Hi Anthony! Earl's right, things can get rather involved when you start discussing ALL the things that affect whether or not a board is going to warp. The way I look at the issue is try to separate the warp issue into two catagories; 1. The board bei

Re: Adhesion of conformal coating to plastic components

Electronics Forum | Wed Jun 03 01:06:13 EDT 1998 | Mike Moninger

| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al

Re: 15G PQFP

Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach

I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad


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