Electronics Forum | Mon Dec 07 11:32:20 EST 2009 | brianksc
Hi All, I am trying to figure out the best way to rework around 2.7K worth of 48pin QFP ICs. I am trying to salvage these ICs from defective PCBA and they have quite a bit of rosin flux on them. Does anyone know how to get the flux off while minim
Electronics Forum | Tue Jan 26 09:33:24 EST 2010 | smt_guy
Hi, I have a copper plate that we received from supplier with oils and some sort of stains. We tried most of the general type of degreasers by soaking but didn't work until we tried a Floor Stripper from Ace and it does make the copper clean and shi
Electronics Forum | Wed Sep 01 14:45:57 EDT 2010 | mmccance
Has anyone had any experience with SANSDA? We have a board loader that was bought used with no documentation. We have tried to contact them requesting schematics or a SMEMA manual to no avail. The loader is not completing the circuit telling the d
Electronics Forum | Tue Oct 26 16:41:05 EDT 2010 | sai
I have been trying to get the profile right for this part(OMAP3503DCBC) , but still struggle. I'm using the Herller 1809 MKIII oven. I look at the profile recomended by TI and still issue with the solder ball collaps and wetting. My peak temp @256
Electronics Forum | Fri Jan 07 03:34:12 EST 2011 | rpatel28364
Hi Smarts We are having difficulty in reflowing BGA wiht ROHS process on double sided board. We have tried profiling un populated board and profile is meeting upper spec of solder paste. but our customer is saying they have to heat up BGA and board s
Electronics Forum | Fri Jan 21 09:45:16 EST 2011 | davemac62
Thanks Jeff. Guess I didn't tell enough of the story. I can get the 1st part location taught (it looks like) but when I try to pick a part from the tray using adjust assistant (F6), the head changes to the appropriate nozzle and tries to pick from th
Electronics Forum | Fri Apr 01 17:45:31 EDT 2011 | smt_guy
thanks for all your replies. we tried running our beta runs and have lots of issues. first our molding process which was set to 450'F temp at 1200 PSI smashed the circuit card components and penetrated the epoxy compound we used to encapsulate the C
Electronics Forum | Fri Apr 29 19:39:58 EDT 2011 | jbaez1
Hi, have somebody out there experienced problems picking up passive components with flexjet head FJ7P?? Just 1 nozzle-spindle is failing, trying to pickup a resistor,cap or diode; I have already changed nozzle tip, nozzle adaptor including springs,va
Electronics Forum | Mon Oct 03 16:02:55 EDT 2011 | artposada
The machine does not have pre-heating feature. I'm soldering a six-up panel...I've tried putting them a an oven and letting them soak for 20 mins or so at a low temp. But by the time I placed the panel in the machine and manually fluxed the top sid
Electronics Forum | Wed Sep 19 12:27:56 EDT 2012 | proceng1
Are you sure that you are getting adequate nitrogen flow up through the cap? If your pump isn't seated properly, you may have nitrogen escaping. Also, I have two different height nitrogen bases. The shorter one does not allow as much gas to escape
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