Electronics Forum | Mon Feb 19 11:48:32 EST 2001 | martys
We are looking at some applications that will require fine-pitch and possibly ultra fine-pitch. I am currently using a spray type batch cleaner for cleaning our stencils. Will this be adequate for fine-pitch (15 � 20 mil pitch) applications?
Electronics Forum | Wed Oct 13 09:15:13 EDT 1999 | Peter Woelflick
Hello, we are looking for usable ultra fine pitch solder pastes with 15-25 um. Does anybody have good or bad experience with a brand/product? If so, please let us know the details. Greetings, Peter Woelflick
Electronics Forum | Tue Oct 30 19:44:12 EST 2001 | davef
I haven�t read this, but maybe you can do a report for us. Look at: �Achieving Ultra-Fine Dot Solder Paste Dispensing� http://www.uic.com/wcms/WCMS.nsf/index/Material_Dispensing_0.html
Electronics Forum | Tue Sep 13 09:08:15 EDT 2005 | russ
Squeege speeds can vary from .5 in/min to 6-8 in/min. It really depends on what the prints look like. For ultra fine pitch I usually start at .8 in/min and take it from there.
Electronics Forum | Fri Dec 09 04:38:11 EST 2005 | Rob
Madam, that's rather forward! By zipper pattern do you mean offsetting the apertures on every other ultra fine pitch qfp pad? Thanks, Rob. (we don't roll in England, we amble)
Electronics Forum | Wed Jun 14 20:05:19 EDT 2006 | Mario Berrocal
I would like to know if there is any information regarding how often to clean the stencil by the printer cleaning system. I am running a board with an ultra fine pithc QFP. Is there any guide available? Regards, Mario A. Berrocal
Electronics Forum | Tue Jun 25 09:55:25 EDT 2013 | bandjwet
We are looking for a recommendation for a company that can perform solder ball inspection on BGAs. The devices are in trays and the the challenge is the ultra fine pitch (0.4mm) and ball size (0.25mm diam). We are looking for ball diameter and coplan
Electronics Forum | Thu Apr 04 16:38:51 EST 2002 | davef
Equipment companies like to talk about �accuracy� and �repeatability�. These measures provide limited information. Flaws of the measure aside, some printer companies have begun to report Cp. * DEK ELA: Cp = 1.33 @ �0.025mm * DEK 265: Cp = 1.6 @ �0.0
Electronics Forum | Tue Aug 13 09:31:48 EDT 2002 | ksfacinelli
I am looking at placing a Altera BGA device that has a .45mm Nominal Ball Dia. with a .8 spacing c-c between balls. The PCB will be gold plated so co-planarity should not be an issue. Interested in suggestions that may assist producability when pla
Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob
Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut
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