Electronics Forum: understand (Page 46 of 189)

Micro crack for lead free wave solder

Electronics Forum | Wed Aug 03 21:29:59 EDT 2005 | Ken

Yes, lead can promote fillet lift. In order to understand this defect you must begin looking at your lead frame mateials. some lead frames are more susceptable to this disorder. This is most likely a cte mismatch disorder. Lead contamination in

REFLOW PROFILE NEED HELP

Electronics Forum | Wed Aug 24 08:51:45 EDT 2005 | james

We do have a slimkic and I will be profiling a board asap. Yes I am looking for a quick answer and I know profiling takes some time. It is just hard to get the M. E. to understand what I want. We just never had a cooldown as part of our profile.

Tombstoning 0306's

Electronics Forum | Sun Sep 11 05:48:32 EDT 2005 | Mika

If 0 or 180 degr. make v-shape openings to each other left & riht, if 90 or 270 degr. top/ bottom, on the stencil apertures; well, you understand... We use this and 87 % reduction of stencil apertures for 0603:s and 0402:s. 0.127 mm stencil thicknes

Same wave process do not apply to all finish board

Electronics Forum | Fri Oct 14 14:00:35 EDT 2005 | patrickbruneel

Mika, If I understand you correctly you compare hole fill of Ni/Au plated boards in a lead-free process with HASL 63/37 boards soldered with leaded solder. If this is the case you might be facing the challenges in Pb free wave soldering with the lim

Seeking for help on MPM UP2040

Electronics Forum | Wed Oct 19 11:50:56 EDT 2005 | fastek

Yes you need to talk to Speedline directly because they will sell you parts for their machines irregardless if you buy it new or used. That goes for Electrovert, MPM, Camalot etc. Good people to deal with. I don't understand Americantech's stance...b

Fine Pitch Stencil Design

Electronics Forum | Wed Dec 14 06:10:24 EST 2005 | tk380514

some of th IPC design guidelines have helped my factory understand the importance of stencil, (before me they used 9 year old guidelines) carzy i know, if you are interested in stencil design then listen to what everyone else has been saying however,

Tg and reflow

Electronics Forum | Fri Dec 16 18:37:10 EST 2005 | mdemos1

Hi. I am trying to understand Tg and how it relates to reflow. With the higher temperatures of lead free, we have been looking toward laminates with a Tg of 180 instead of the current 140. My question is a little more general. In either lead free

gold wire bonding

Electronics Forum | Wed Dec 28 03:33:31 EST 2005 | sparrow

I would like to know if ENIG is widely used for the thermosonic gold wire bonding or this application is an exotic one. And I also wold like to talk to someone who uses printed circuits with ENIG finish for such an application. I do not quite underst

SPC for Wave solder (defects on PCB's)

Electronics Forum | Thu Feb 16 09:00:35 EST 2006 | russ

Samir, You are a nut! I wouldn't cut your hands off! I asked because I was wondering about the stability and repeatability of the wave machine itself being used as the standard. I do understand Gage R&R or at least I think I do that was why I aske

Aluminum tape

Electronics Forum | Thu Feb 16 11:40:40 EST 2006 | russ

I am in agreement with Steve. I take great pains to ensure that my tape jobs do not come undone. As someone else noted I also preload the tip to the board so it stays in contact. I still need to ask why do we need to care about this tiny differenc


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