Electronics Forum | Wed Oct 09 08:44:51 EDT 2002 | pjc
Hey, that's not nice to say. The complete big-fish-eat-little-fish story is Nicolet Imaging Systems bought SRT, GenRad bought NIS, Teradyne bought GR. I think its safe to say that it will end here as I cannot see Teradyne being eaten- too big to swal
Electronics Forum | Wed Oct 16 08:23:09 EDT 2002 | caldon
Dave is right...they are all great machines and all have benefits that cause them to differ... They all jockey for the top spot with in PNP machines. Dave makes a point with his analogy, all are good machines but have specific purposes. Daves range
Electronics Forum | Fri Oct 18 07:56:26 EDT 2002 | cyber_wolf
I have a question to pose for all of you. We use BTU TRS ovens for all of our SMT reflow. Anyone that has had any experience with these ovens knows that they are large and the have a lot of " thermal mass" Which means to me that they are very stable
Electronics Forum | Thu Oct 24 17:20:07 EDT 2002 | bdoyle
Here let me try this out. There are some special characters that have certain html codes. Quotes are an example, same with trademark references...and degree symbols. This should be a degree symbol: ° so I could write: 99.9° Now, to use this yo
Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125
We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th
Electronics Forum | Wed Oct 23 16:17:17 EDT 2002 | nwyatt
CSP is similar to BGA process in that you need to undergo a reflow process to properly solder the chip. Also, a soak period is desirable to promote outgassing. You do not need nitrogen. We are building CSPs in a regular convection oven without n
Electronics Forum | Wed Oct 30 09:16:51 EST 2002 | russ
Low air flow huh. This is interesting, I have a low end machine that has adjustable air flow and I was having some shorting problems awhile back (corners mostly) and my first attempt was to preheat the board up to 170C and then use lower temp to put
Electronics Forum | Mon Oct 28 18:59:25 EST 2002 | tkenny007
Specs for Bow and Twist for PCBs (IPC-A-610C, 10.6. There may be an update by now). I also have a note in our quality guide referencing (IPC-TM-650, 2.4.22) and (MIL-STD-105D). In summary, a PCB should not bow more than 0.040" with all four corner
Electronics Forum | Tue Oct 29 15:07:38 EST 2002 | gregp
SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go
Electronics Forum | Tue Nov 05 14:10:54 EST 2002 | genny
Is there any way that there could be an indicator when we access the site or the forums, that lets us know we have mail? We used to be able to see that info under the old design. I don't use it a lot, but recently when I had a hot thread, I was ge
