Electronics Forum | Wed Jan 24 11:24:07 EST 2007 | ruggi
I'm probably not telling you anything you don't already know, but a technique that's worked very well in the past for me is to methodically step through every part of the process and observe your boards being built, or take a scrap or simulated one a
Electronics Forum | Sat Jan 20 23:48:55 EST 2007 | bvdb
Hi Al, Thanks for the suggestion. Yes, I should have said that the cable has been checked and another cable tested with the same results. In addition to the three wires that carry the transmit data, the receive data and the data signal ground, the
Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
Electronics Forum | Fri Mar 02 15:42:27 EST 2007 | mmjm_1099
Hey all, I have a question for yall that I need some input for. It has been brought to me to help speed up production. We are currently running only a first shift. Well first let me explain my line: Line 1 - DEK01, CP43, QP341, Heller oven and Line 2
Electronics Forum | Thu Mar 08 08:03:16 EST 2007 | ck_the_flip
ENig can vary in quality, but I've never seen an ENiG board that's been downright unsolderable. At a CM where I worked, I had to prove a QE wrong. He was flippin' out (*no offense*) about black pad, something commonly seen on ENig boards, so what I
Electronics Forum | Fri Mar 09 18:32:29 EST 2007 | siverts
We have seen this issue with our RoHS process also. If that is the case and I if understand you correctlcy; then the advice from KSimpson, Stephen, DaveF + "all others" is totally correct!! We have been under this problem a numeruos numbers from time
Electronics Forum | Tue Mar 13 17:29:18 EDT 2007 | Oswaldo Rey
I placed a Maxim MAX16810 38 pin TQFN with a power pad ground on the bottom of the chip on a prototype board FR4 doble sided. Vias of 0.6 mm where placed underneath part, 6 vias in total. Solder was placed with an air operated syringe, land pattern w
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Tue Mar 20 00:02:00 EDT 2007 | Darby
Some causes of skewing. If you have exhausted all mechanical problems for that head. Pickup data from tray is incorrect. If you aren't picking up in the exact centre it is possible that the component is being skewed after vision adjustment i.e. cent
Electronics Forum | Wed Mar 21 17:47:05 EDT 2007 | darby
You need to use the H nozzle and 4 small jaws (1005). Have the slot in the jaws machined towards the rear of the jaw to increase reach. Set up and calibrate that head with that chucking assembly. Always use the same chucking assembly on the same he
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