Electronics Forum: ups (Page 861 of 1183)

UP1500 Frame Sizes?

Electronics Forum | Tue May 03 08:11:02 EDT 2005 | jh0n!

I appreciate the detailed reply. However, I had tried dimensioning the stencil to everything imaginable, including the correct/measured dimensions. Interestingly enough, after loading a new stencil into our adaptor, I had no errors with the new pro

UP1500 Frame Sizes?

Electronics Forum | Wed May 04 09:37:08 EDT 2005 | MikeaJ

I would not recommend trying to cram or mix and match multiple images on a stencil. Especially if you are a contract house, and your clients don't understand why sending one board seperate from a panel of four is a pain in the face. However, I have h

BGA & QFP post reflow inspection

Electronics Forum | Wed May 04 19:09:52 EDT 2005 | russ

Can you not just check the part when it is on line and being loaded into the machine? You should only need to check this once. Verify your setup to the bom and not your assembled boards to the BOM. Correct setup and program = correct boards. More

Leadfree dip soldering

Electronics Forum | Wed May 04 11:54:29 EDT 2005 | HOSS

Rob, Are you hinting that the lead content of this component with dipped tin/lead solder would not be an issue with RoHS? If so, our understanding is that the legislation requires that the 6 banned substances cannot exist at greater than X% in any

competeing with CEI of Singaphore?

Electronics Forum | Sat May 14 17:25:20 EDT 2005 | fastek

"What can be done to create economical advantages over here is review the product flow and eliminate process steps with current existing technology. Process steps that can safely be eliminated are cleaning, visual inspection, post wave assembly etc.

Machine won't change nozzles

Electronics Forum | Mon May 16 11:45:35 EDT 2005 | PWH

Agree with PDE. We have two GSM's and we get this error often. Palm down e-stop when you get this error message. Machine will drop nozzle bank down after doing some segment repairs. Open covers and make sure nozzles are seated in reference to ali

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.

We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 04:17:05 EDT 2005 | kvanzill

Hello All, I recently accepted a position in a manufacturer in Mauritius and they have begun a little more then a year ago COB process which I am unfamiliar with and needing some help. We are using aluminum wire, the machine is Dias Automation model

A.O.I recommendation

Electronics Forum | Tue May 24 08:54:02 EDT 2005 | stepheniii

I have experience with Mirtec, and overall I think it actually performed better than advertised. Although I have to point AFAIK all AOI machines are operator dependant. I was working at a company with around 8 runs a day, and such variety and ECO's

I'm back in the saddle, and it's a ....

Electronics Forum | Wed May 25 12:49:51 EDT 2005 | Steve Thomas

tuckered pony I'm riding. Nearly two years off from the biz, and the place I landed is the place I sold a bunch of used equipment to while at my last job. It's deja vu all over again. Anyway, I'm a little more active with the placement equipment he


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