Electronics Forum | Mon Aug 19 09:42:56 EDT 2002 | blnorman
I agree with analysis. You'll never accurately find the source until you determine exactly what the "goo" is. We have this problem, but like previous posters, the goo is flux residue. We do use the ovens for both reflow and adhesive cure. The adh
Electronics Forum | Tue Aug 13 15:55:10 EDT 2002 | jseagle
I am looking for advice on purchasing a used '98-'00 Electrovert Electra wave soldering machine. Are there any specific parts of the machine I should closely inspect? Any specific options I should make sure it has? I will need it to have a spray f
Electronics Forum | Wed Aug 14 16:34:46 EDT 2002 | ksfacinelli
I have a PCB laminate that is 1 1/2 years old and showing signs of poor solderability. The NC flux I am using will not breakdown the oxides. During hand soldering the pads do not take solder. I am trying alternative fluxes and have seen an improve
Electronics Forum | Mon Aug 19 04:57:17 EDT 2002 | surachai
SIPAD solid solder deposit and glue dots is an > excellent solution. > > http://www.sipad.com > > Matt > Kehoe SIPAD Systems Inc Thank you for your information , but I would like to know the information of normal process like a flip process bu
Electronics Forum | Fri Aug 16 06:52:00 EDT 2002 | Bach Huss
We are using the MVT as our AOI Machine. Some how after the reflow (in Testing) we still find defects. We think missing part should not happen once we have the MVT. However there are still escapee from the MVT (0.5 %). We are actually planning to h
Electronics Forum | Tue Aug 20 07:35:04 EDT 2002 | bmulcahy
Hi, I guess you a looking for a manual x-y table with a vacuum pick up such as SMT6000 from OK industries. I presume these are still being made-- We use one successfully at the end of a Mydata machine to place low volume components which we cannot j
Electronics Forum | Fri Aug 23 22:22:01 EDT 2002 | caldon
We have a great sophistcated Manual/Semi Assembly station available for BGS, QFP, Chips, CSP......Can use matrix trays, tape reel,Cut tape reel, loose parts, and sticks. Please contact me off line for more details. I am not a salesman....AppsEng.
Electronics Forum | Wed Aug 28 10:51:27 EDT 2002 | edmentzer
We use a manual "pick and place" unit similar to the OK product, and it work great. The parts are in a tray and the operator moves the pick up head over the part and press down which turns on the vacuum, the vacuum is turned off when the part is pla
Electronics Forum | Tue Aug 20 22:37:15 EDT 2002 | dwoon
I notice that dip fluxing method is commonly used in flip chip assembly (FCOB, FCOC and FCOF). Main reason: better flux control. How about spray fluxing (e.g. the non-contact jetting technology from Asymtek)? Does anyone has experience adopting thi
Electronics Forum | Wed Sep 04 14:14:55 EDT 2002 | melo_guy
I like that "Lies, dam lies and statistics." thats a riot, only because its SO TRUE. Ill remember that i'm sure ill be able to use it sometime. My company does a lot of those graphs and charts that all relate to things that make no sense. I'm in c
