Electronics Forum | Fri May 09 09:29:25 EDT 2003 | gregp
Thanks for the response k_h, A few follow up questions... 1. 70-90 slots seems low for a one machine line. What is the maximum number of different parts on your worst case job? 2. Could the common parts be adressed by being assigned as "point of use
Electronics Forum | Fri May 09 11:09:47 EDT 2003 | k_h
Each machine has two feeder tables, one is fixed, the other interchangable. Parts on both sides of the machines does not create a kitting problem but can be inconvenient for feeder replenishment. I have found "U" shaped lines to be much more operator
Electronics Forum | Mon May 12 10:48:49 EDT 2003 | Theresa Woodford
Does anyone have any experience with plasma cleaning? I currently have an IMS Substrate (10-15 microinch gold flash over electroless Ni) attched to Ryton PPS / R40 walls (40% glass filled/compression molded). The wall is being attached to the IMS u
Electronics Forum | Mon May 19 09:29:59 EDT 2003 | bradlanger
Dave, We are using Kester Easy Profile 256 No clean Sn62Pb36Ag02. The oven itself is a Dima SMRO-0252 which is a short oven, it has 13" of preheat, 13.5" of soak, 6.25" of reflow, and 10" of cooling on the way out of the oven. We are soldering multi
Electronics Forum | Wed May 21 09:31:09 EDT 2003 | caldon
I need to first understand what "Peeled the BGA off" means. Was heat used? was this the pry and lift method? We had shorts under some BGA's we have and the solder was bridging from lead to lead but not on the board level at the FR4 on the BGA creati
Electronics Forum | Thu May 15 14:11:04 EDT 2003 | Dyann
Hi, I'm a non-technical person working for a small MFG company that uses SMT. We are experiencing a high level of board failures due to "insufficent soder". Where is the best place for me to get data to bring myself up to a level of knowlegde on
Electronics Forum | Wed May 21 15:47:34 EDT 2003 | JB
We have an HSP 4796, if the feeder mechanism is the same, this may help you a bit. First make sure that the componet definition is right on the component library. Tape or Embossed. Second, the component thickness vs actual thickness. Is the pick u
Electronics Forum | Wed May 21 20:58:48 EDT 2003 | star7483
APPLICATION: SMT CARRIER TAPE FEATURE: �� High efficiency: joining is accomplished without shutting off the machine. The SMT machine can increase output 5%-15%. �� Reducing SMT machine and feeder abrasion: There is no need to unload & reload feeder
Electronics Forum | Tue May 27 12:53:15 EDT 2003 | davef
Our solder irons are tuned to 700*F, but the in-use temperature varies according to the solder alloy and the characteristics of the board and components. Check some of the papers on multilayer ceramic capacitors. They get fairly specific, for insta
Electronics Forum | Wed May 28 14:35:47 EDT 2003 | davef
Wow, you're very correct. I guess we use silicone to calibrate our machine, as follows: XPS spectral measurements of dimethyl silicone should include O(2s) at 25 eV, Si(2p) at 102 eV, Si(2s) at 153 eV, C(1s) at 285 eV, and O(1s) at 533 eV. The C(1s
