Electronics Forum: use (Page 2176 of 2497)

BGA Rework

Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ

When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra

MPM UP2000 Hi-e

Electronics Forum | Wed Aug 30 23:58:53 EDT 2006 | jasmin

We are looking into purchasing a used UP-2000 > Hi-e. We are high mix /high change-over. The > machines I am looking at are equipped with the > grid-lok system. > > Can anyone give me pros's/ > con's ?? > > Thanks in advance. > > Sr. Hi Sr T

MPM UP2000 Hi-e

Electronics Forum | Thu Aug 31 19:40:22 EDT 2006 | cardinal

A couple things on the Grid-Lok system. They now offer a top-side edge clamping system. The edge clamping system works very well for warped, twisted boards etc.. Using this system in the auto mode also allows the pins to contour to the geography of

Reflow Carriers

Electronics Forum | Mon Aug 28 17:02:07 EDT 2006 | SWAG

We are constantly messing around with easy ways to transport double sided boards through reflow. (Boards that cannot ride on the chain fingers for any number of reasons). We've got some fancy Durostone carriers that work awesome but are product spe

Reflow Carriers

Electronics Forum | Tue Aug 29 07:40:20 EDT 2006 | CL

Good Morning SWAG, We have the same situation. We have found that for the most part, bottomside components do not move from thier location durring reflow unless pressure is applied. We have had instances where the component is able to drop down into

IPC Questions........

Electronics Forum | Wed Aug 30 07:45:08 EDT 2006 | davef

18-30*C, 30-70%RH * Particle count: ** Institute of Environmental Science and Technology (IEST) sets up the criteria and measurement methods to determine cleanroom class [eg, 10, 100, 1000, etc]. Consult their web site and perhaps take one of their

Qualification requirements for immersion tin finish

Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.

Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O

T tech vs LPKF

Electronics Forum | Thu Aug 31 18:19:27 EDT 2006 | dmascare

I am currently contemplating the purchase of a pcb prototyping machine. The machine will be used to prototype some patch antennas, microwave circuits, embedded systems, boards for various surface mount chips evaluations, possibly milling PZT materia

T tech vs LPKF

Electronics Forum | Tue Oct 10 18:17:13 EDT 2006 | Dave from Ohio

We currently use both machines side by side in our lab now and LPKF is by far the better machine. Both are comparable systems to each other but the T-Tech machine always seems to have problems of some sort and their tech support department isn�t ve

Yamaha YV100 Feeders

Electronics Forum | Tue Sep 12 01:54:57 EDT 2006 | AR

I assume that you are referring to the same kind of mechanical feeders (older type) that are used on the Philips (Assembl�on) Topaz as well. First make sure that the right gear pulley spring is set to its stiffest position (the loop at the end of the


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