Electronics Forum | Wed Aug 18 08:32:20 EDT 2004 | Santech
If anyone is interested, I have a brand new Super M.O.L.E. Thinline that I am looking to sell. It includes the case and all the software and hardware originally with. It has been used 1 time. Brian 336-337-0333
Electronics Forum | Sun Aug 15 20:27:20 EDT 2004 | KEN
I think you are going to find it very difficult for people to hand over the formula for a sucessful LF process.
Electronics Forum | Mon Aug 16 09:17:13 EDT 2004 | russ
For flatness - Put the part on a leveling plate and roll a dial indicator across it. The leveling plate is not required for a true flatness check but using this will also work for parallelism of lead base to top of body.
Electronics Forum | Tue Aug 17 18:20:22 EDT 2004 | steved
Hi- Our company is looking into purchasing some optimization software that will be used for equipment changeover applications....specifically to reduce changeover times. Can anyone share some good and bad experiences out there and/or suggest some v
Electronics Forum | Tue Nov 23 08:46:19 EST 2004 | mmjm_1099
Has anyone else used the Multi-Job Balancer? I am considering this but of course cost is slowing down the decision making. On average we do a 30-60 feeder setup and switch out to about 4 jobs a day. So any input would be highly appreciated.
Electronics Forum | Thu Aug 19 14:26:02 EDT 2004 | resource
Hi Snehal, Plenty of useful inputs have already been offered here . Lead free compatibility indeed is a good suggestion. How about also considering maximum & operational power consumption of such an oven ? Rgds
Electronics Forum | Sun Aug 22 17:12:55 EDT 2004 | Mark Hugill
Hi All I would like to know if there is software available to optimize placement files for Samsung machines. We are currently using the on-line software off-line but combine setups and just plain ordinary setups and optimization are painfully slow.
Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee
Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank
Electronics Forum | Mon Aug 23 13:39:30 EDT 2004 | ozzy
I think the first is a .1uF because it is being used as a charge pump cap on a max202cpe.
Electronics Forum | Wed Sep 01 09:28:20 EDT 2004 | Phil
Ozzy, it is a 1uf cap, not a .1. The 5 indicates 5 zeros after the 1. The MAX-232ACPE uses .1 uf caps. You indicated that it was not the "A" version. phil.hopkins@apcc.com
