Electronics Forum: use (Page 86 of 2497)

0402 placement using Quad 4C

Electronics Forum | Wed Mar 07 19:17:17 EST 2001 | mleber

If anyone is placing 0402 components using a Quad 4C I would like to hear any tips or advise. We have a job that is loaded with them.

Removal of Hot Metal Shield for Rework

Electronics Forum | Wed Mar 14 09:58:07 EST 2001 | dason_c

I am not sure that how big of your shield, I am using Metcal Soldering System and modify the Metcal Removal Tip to cut into half. I don't want to use hot air and it may damage the component inside.... Rgds. Dason

Murata cap wetting issues

Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef

Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes

Heat Sinks

Electronics Forum | Mon Dec 18 09:42:44 EST 2000 | floydl

When designing high performance circuit boards are there methods that can be used to improve thermal conductivity without using heat sinks? Can boards be designed in a way that reduces or eliminates the need for sinks?

Lead Free Solders

Electronics Forum | Mon Dec 18 09:37:31 EST 2000 | markt

What are the driving reasons behind the use of lead free solders? What is the environmental impact of leaded solders? What effects can be expected by continued use of leaded solders? Is this something that we sould be concerned about world-wide?

PIHR

Electronics Forum | Thu Jul 20 13:49:20 EDT 2000 | Jeanette

When dispensing paste would you reccomend dispensing the paste first then inserting the component or inserting the component, clinching the leads and then dispensing the paste. I have heard that the latter may cause dry joints. Would you use the sa

Re: Lead free

Electronics Forum | Thu Jul 20 16:02:46 EDT 2000 | newf

Will component manufactuers need to look at possible new coatings for pins when to be used in a PB- free enviroment? PT 2 Will new solder joint inspection criteria have to be developed for the use of lead free solder?

Press-Fit Workmanship standard

Electronics Forum | Thu May 17 22:12:30 EDT 2001 | davef

OK, OK. Howabout this? http://www.teradyne.com/prods/tcs/docs/techbull/TB2014.pdf I found this using http://www.ilor.com ... kinda cool front end to Google I found today. [Yall probably have been using it for months]

Autoprogram for DOS

Electronics Forum | Mon May 21 12:33:32 EDT 2001 | Steve23

Yeah, I actually use Autoprogram 5.3.2 also, but I use it on a Windows95 machine, and it works OK. I would like to get a copy of the DOS version just to see how stable it is.

Removal of screening cans

Electronics Forum | Wed May 23 02:45:37 EDT 2001 | johnluckham

I am looking for a way of removing screening cans from a PCB without reflowing the components siyuated under the can. I remember HP use to make a laser that could be used for this job, had anyone got, or had experience of this problem.


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