Electronics Forum | Thu Jan 05 15:09:37 EST 2006 | grantp
Hi, What studies? Can you post a link? I am not sure what the difference is between a ceramic BGA that the high temp solder ball is not expected to collapse, and a lead free solder ball that's run through a lead process and also does not collapse b
Electronics Forum | Thu Dec 01 14:47:25 EST 2005 | Amol Kane
Hi, I am testing some lead-free assemblies using ATC. it was suggested to me that if i do in-situ testing, then i should measure the starting resistance, and subsequent resistances values after n cycles, and when the resistance value increases by 1 o
Electronics Forum | Sun Dec 04 07:37:09 EST 2005 | stepheniii
At least here the solder paste industry is competive, and each rep wants to be sure you are using their paste properly. Therefore they are willing to help you out. They are afraid a competitor will come in and show you his paste is better when in f
Electronics Forum | Fri Dec 09 16:38:20 EST 2005 | Csommers
I looked at Yestech and Mirtec. Evaluated both products and decided for Mirtec. After using the system for a couple of months I decided to send it back. There is a lot of problems with bugs in the software, falls calls are in the high numbers and the
Electronics Forum | Wed Dec 07 12:43:04 EST 2005 | Frank R.
Hi, For now we use a Specnor wave and we will by another one for Lead-Free process. We look for an other Specnor but we can have another one from Novastar Model 18FDE. Is someone work with a Novastar wave and do you have some recommandation (concer
Electronics Forum | Mon Dec 12 13:34:15 EST 2005 | jbrower
Hi Frank I use an electrovert econopak and am very pleased with it. Electrovert offers a leadfree upgrade to the pot but it is a might bit expensive. Contact them for pricing. In my machine I am going with SN100 distributed by AIM. It might be some
Electronics Forum | Fri Dec 09 08:53:12 EST 2005 | russ
We used flash gold once by mistake and we did pay for it. A very high fallout of BGAs and some of the leaded devices for latent failures from fractured solder joints. I do not know how the other types of components faired in this process but I woul
Electronics Forum | Tue Dec 13 22:44:35 EST 2005 | Mike Kennedy
Russ, After a bit more research, I have found that the FLASH gold process doesnt use Phophrous in the process so should not have the black pad problems of ENIG. I am now surprised that you had problems. What did you experience? Was it an oxsidisation
Electronics Forum | Wed Dec 14 06:10:24 EST 2005 | tk380514
some of th IPC design guidelines have helped my factory understand the importance of stencil, (before me they used 9 year old guidelines) carzy i know, if you are interested in stencil design then listen to what everyone else has been saying however,
Electronics Forum | Sat Dec 10 08:13:53 EST 2005 | davef
We believe imm tin suppliers say that their product does not whiskey, oops whisker, because they use 'white tin' not the 'gray tin' that causes whiskers. But as soon as you alloy their tin with SAC or any other high tin content solder, all bets are
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