Electronics Forum: used (Page 2031 of 2497)

Re: Glue Witness Pattern Verifiable by FUJI???

Electronics Forum | Thu Dec 07 16:58:42 EST 2000 | NickMata

You're correct, it does not matter on dual dots because they should be the same size. My concern is given that the FUJI will not see dual dots as a single item, in order to verify both dots I would have to program as them as seperate fids in which ca

Re: baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M

Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa

Re: Broken capacitors

Electronics Forum | Mon Dec 04 11:14:03 EST 2000 | JimH

All, For what it's worth the only time I have experienced this phenom was when board support pins were misplaced on our chip shooter and these components (previously placed) were resting on the pins and cracking when we populated the other side o

Re: Broken capacitors

Electronics Forum | Fri Dec 08 23:02:24 EST 2000 | LeeKibler

Beware the foam fluxer. I had a problem with cracked caps that just about drove me off the deep end. I discovered that my foam fluxer air knife was not turned on resulting in excessive flux. The excessive flux (VOC free) was not properly dried off

Re: Fine Pitch 48-pin TSOP

Electronics Forum | Fri Dec 01 00:37:20 EST 2000 | arminski...aka..Dreamsniper

I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they o

Re: Automatic lead placement system

Electronics Forum | Thu Nov 30 23:48:16 EST 2000 | DL

Dave, Thanks for the input. I cant beleive I didnt think to check the suppliers web site, I feel like an... well anyhow. The leads I'm referring to are place at a 90 degree angle from the edge of the pcb and extend towards the bottom as opposed to

Re: Process Characterisation

Electronics Forum | Wed Nov 29 21:05:33 EST 2000 | Michael Parker

Chris- you did not mention some details regarding your processes and volumes. Are you using SMT, PTH, mixed? Machinery involved (automatic vs. manual). Volumes - same 4-20 assemblies, at what periodic rate? Are you doing R&D prototypes only? High or

Re: Siemens HS50 and F5 and S25

Electronics Forum | Tue Nov 28 16:28:14 EST 2000 | CAL

Chris- The machines you identified are stable products and have been around for over two years now and most bugs have been worked out. The F5 IC head has not changed much since its introduction over 5 years ago. Remember these machine like to run, r

Re: Solder paste recovery

Electronics Forum | Wed Nov 29 10:50:24 EST 2000 | blnorman

Vacuum casting (same process used to make solid rocket motors) should remove any air from the paste. We had thought of pressurizing the tubes to remove the residual paste, but that would entrap air. The problem of tubes sitting out for different

Downtime on SMT lines

Electronics Forum | Thu Nov 16 03:41:43 EST 2000 | Willem Combrinck

Hi everyone. I'm an industrial engineering student working at a manufacturing company in Cape Town, SA. Recently my boss wanted to know the causes of our downtime in SMT. Things like setups, unscheduled maintenance, debugs etc came up while I was doi


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