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Electronics Forum | Tue Dec 11 19:41:28 EST 2001 | lsjp
Hi there, I am a bit late in answering the question about removing (and probably replacing) those d&%&$Z3 Mictors. Are they straddle mount or vertical? How many segments? What's the configuration of the board (PCB thickness, adjacent components, part
Electronics Forum | Tue Nov 20 12:21:02 EST 2001 | mparker
First, determine a standard to follow. IPC/EIA J-STD-001C "Requirements for Soldered Electrical and Electronic Assemblies" is most current for electronic assemblies. Second, by your customers spec. determine which class of the standard to apply. Use
Electronics Forum | Fri Nov 23 03:40:09 EST 2001 | ianchan
Hi All, agree 100% on product characteristics SPC, and do find process indicators such as paste Volume, useful to monitor via SPC, the printing process, as printing constitutes "70% cases of SMT defects". We juz purchased a 2nd hand CyberOptics 3D
Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve
We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Sat Nov 24 22:15:16 EST 2001 | Glenn Robertson
Tony, I'm not sure if even baking will stop the voids if you have gaps in the plating. It probably doesn't take much moisture or even trapped air. I'm not speaking from a lot of direct experience here, so please run the tests and let us know wh
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Tue Nov 27 10:16:07 EST 2001 | davef
Oooo, I get it. We do that trick on the wave solder side of boards. On the bare board, during design / layout, the basic shape of the jumper is a 125 thou disc of copper [that of course is eventually covered with whatever solderability preservative
Electronics Forum | Tue Dec 04 13:23:05 EST 2001 | fmonette
Hi Steve, It sounds like your product will have many moisture-sensitive devices on both sides. You should be aware of the additional controls that are required to insure the reliability of these components in a double-side reflow application. The
Electronics Forum | Mon Aug 26 20:31:34 EDT 2002 | davef
Yes, it is quite common. Does it [refraction] provide adequate resolution? => Depends on: * What you mean by �adequate�. * When during the process [cleaning solution life] you make the measurement. Is the [refraction] measurement affected signifi
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