Electronics Forum | Thu Aug 24 19:26:07 EDT 2006 | darby
Dave, Cygnal was taken over by Silabs. I based my design on the second link that you provided. Tell me folks, are you using one large pad with only the stencil having the grid, or are you actually breaking up the large pad into grids with mask around
Electronics Forum | Tue Aug 22 13:13:30 EDT 2006 | slthomas
We are a low volume (100k-150k parts per month) high mix shop that is equipped with a couple of Quad IVc's. The machines meet our overall capacity needs but can not give us the quick turns we need if we get hit with multiple large setups at once.
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ
When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra
Electronics Forum | Wed Aug 30 23:58:53 EDT 2006 | jasmin
We are looking into purchasing a used UP-2000 > Hi-e. We are high mix /high change-over. The > machines I am looking at are equipped with the > grid-lok system. > > Can anyone give me pros's/ > con's ?? > > Thanks in advance. > > Sr. Hi Sr T
Electronics Forum | Thu Aug 31 19:40:22 EDT 2006 | cardinal
A couple things on the Grid-Lok system. They now offer a top-side edge clamping system. The edge clamping system works very well for warped, twisted boards etc.. Using this system in the auto mode also allows the pins to contour to the geography of
Electronics Forum | Mon Aug 28 17:02:07 EDT 2006 | SWAG
We are constantly messing around with easy ways to transport double sided boards through reflow. (Boards that cannot ride on the chain fingers for any number of reasons). We've got some fancy Durostone carriers that work awesome but are product spe
Electronics Forum | Tue Aug 29 07:40:20 EDT 2006 | CL
Good Morning SWAG, We have the same situation. We have found that for the most part, bottomside components do not move from thier location durring reflow unless pressure is applied. We have had instances where the component is able to drop down into
Electronics Forum | Wed Aug 30 07:45:08 EDT 2006 | davef
18-30*C, 30-70%RH * Particle count: ** Institute of Environmental Science and Technology (IEST) sets up the criteria and measurement methods to determine cleanroom class [eg, 10, 100, 1000, etc]. Consult their web site and perhaps take one of their
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
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