Electronics Forum | Tue Oct 08 09:51:10 EDT 2002 | larryk
Russ, I use the R562, it has a longer tack time then the Hm531 and have found no problems with voiding on my BGAs. You may want to evaluate this formula also Larry
Electronics Forum | Tue Oct 08 18:54:04 EDT 2002 | BobbyB
Hey Russell. The boys at Air-Vac Engineering can help you solve your problem. Are you using an DRS system. If not, you are probably out of luck and should scrap the boards. Cheers!
Electronics Forum | Wed Oct 09 17:44:46 EDT 2002 | alj
I guess you don't use one. Call them and I'm sure they will solve your problems and teach you a little bit about BGA rework profiling... CHEERS!
Electronics Forum | Tue Oct 01 18:32:55 EDT 2002 | davef
We don't like ministencils. Consider using the patterns listed in the Practical Components and Topline catalogs. Few BGA we see have a 3X3 courtyard.
Electronics Forum | Wed Oct 02 21:01:20 EDT 2002 | davef
I'm looking for a turtle ~5" in diameter with no fussy lineage to use as a paper weight. Are you too far West?
Electronics Forum | Sun Oct 13 08:53:46 EDT 2002 | greenman
TI found an improvement in solderability on their Ni/Pd lead-finishes by using inert (nitrogen) reflow, but this is an expensive operation for just one part.
Electronics Forum | Sat Oct 12 05:05:09 EDT 2002 | Kenture
I run 0201 on a 5 mils stencil with openting of 15X12 and did not have any issue. The major concern is the placement and CP643 did very good job. Type 3 solder pastes was used. Good luck.
Electronics Forum | Wed Oct 09 12:24:11 EDT 2002 | dphilbrick
Why not go to VOC free flux. It is a water based no clean. Clean it when you need to and leave it when you don't have to clean. We have used it for several years. We do Military and Commercial - passes for all so far.
Electronics Forum | Wed Oct 09 12:29:14 EDT 2002 | ppcbs
We have been encountering black pad contamination on gold plated boards mainly affecting BGA components during assembly. This problem has been noticed with many of our customers that are using an array of fab vendors. Does anyone have a solution fo
Electronics Forum | Sat Oct 12 05:40:05 EDT 2002 | Kenture
Hello All, I am having issued with insufficient solder due to via in pad. It is a 10 mils via and PCB is 70 mil thick. Six mils stencils was used since there are some 20 mils (No clean process). Any recommendation? Thank you.
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