Electronics Forum: vacuum failure (Page 1 of 4)

Timeout waiting for nozzle changer vacuum buildup.

Electronics Forum | Fri Sep 01 09:54:02 EDT 2017 | gsmx4321

I get a Timeout waiting for nozzle changer vacuum buildup failure every time I go to run my 1998 GSMx machine. The problems seems to be that once in a while (it seems to be random) the spindle does not line up exactly in the center of the nozzle cha

Mydata TP11 UFP hardware initiation failure

Electronics Forum | Wed Jul 26 16:08:29 EDT 2006 | ev

My focus has moved to the X motor itself. The one common factor in this paricular problem has been the time of year. The day was a particularly hot day with high humidity. Even though there is a "Xfan" connection on the PIAB board I do not believe th

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson

Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part

BTU VIP98 Oven refuses to start

Electronics Forum | Thu Jan 04 15:39:49 EST 2007 | realchunks

Is it a failure or a schedule overdue? If it's a failure check the vacuum sensor in the exhaust. You should be able to locate the straw and follow it back to the diaphragm. You can adjust the diaphragm. Or you can electrically jumper past it.

Philips Sapphire users......

Electronics Forum | Mon May 21 21:31:08 EDT 2001 | Dean

I would like to hear from all Philips Sapphire users about your successes and failures when placing 0402 parts. 1. Are you using type 51 / 57 nozzles? 2. Special vacuum check? 3. How are you calibrating your vacuum sensors? 4. Have you expe

Re: Drying ICs any advice

Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Universal GSM 2

Electronics Forum | Thu Oct 09 17:37:58 EDT 2014 | rgduval

Got a failure while starting up our GSM, and hoping you guys have an easy fix that we're not seeing. We're getting a Timeout waiting for nozzle changer vacuum buildup. It seems to be occurring on head 2, during nozzle change. We've reseated all of

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick

You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i

Re: Criterion of PCBA bending degree

Electronics Forum | Thu Jun 10 14:52:55 EDT 1999 | Earl Moon

| Hello all! | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's the pr

Re: Cracking Capacitors

Electronics Forum | Thu Sep 03 18:48:52 EDT 1998 | Pete Sorenson

| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre

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