Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
Electronics Forum | Thu Sep 18 15:29:59 EDT 2003 | Gabriele
Hi all, by reading along those thread (SOT23) and Tan outgassing I learned plenty of things. My first time approacing this kind of Q$A Forum, very intesting tech communication way. Any way, the path of magnetism effect was chosen when time ago we met
Electronics Forum | Mon Nov 17 17:26:40 EST 2003 | severs
Not too sure about that compressed air idea.... How dry is the air? Will it be monitored for moisture content? Given that the air IS dry enough (less than 5% RH) You will have to supply compressed air 24hrs per day, without any disruption in flow
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
Electronics Forum | Sun May 23 15:03:06 EDT 2004 | crios
Our printers feedswith consist of 2 LEDs next to each other designed to illuminate in green, red, and amber simultanuosly per operation. The green and red in the LED create the amber (orange) color. Although, we are experiencing a high defect rate d
Electronics Forum | Tue Jun 01 10:11:00 EDT 2004 | davef
Intermetallic growth is a diffusion process, the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the activation energy and R (8.314 J mo
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Tue Aug 17 10:09:34 EDT 2004 | Phil Z
From my perspective, regardless of the size of your company, you want the best value for your money and latest, greatest in innovation. For pick and place, while Mydata, Siemens and Assembleon/Yamaha all have some cool and worthy concepts and worth e
Electronics Forum | Tue Aug 31 10:48:36 EDT 2004 | mriddle
Rob and JohnR The ASC/Samsung VSS Series AOI uses white LEDS and high-speed, high-resolution digital color cameras for image acquistion. While it can inspect for correct color by comparing RGB or HSL values, it does solder inspection by acquiring a
Electronics Forum | Fri Sep 24 11:08:13 EDT 2004 | davef
We're not sure what you mean by temperature sensitive components. From an assembly process stand-point, every component we use is temperature sensitive to one level or another. More specifically, some of our products use polyphenylene sulfide (PPS)
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