Electronics Forum: via and on and pad (Page 1 of 4)

via tenting and pluging

Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam

HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup

| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook

| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent

2 questions: via tenting and annular ring terminology.

Electronics Forum | Tue Jul 06 19:38:01 EDT 1999 | John

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. Q #2) When speaking of annular rings, I have always thought of them as minimums. Su

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant

| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef

For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components

Aperture Adjustments and Etch Compensation on Arrays

Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon

As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris

I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c

SMT on rig-flex and multi-flex boards

Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron

Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t

Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro

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