Electronics Forum: via fill (Page 1 of 19)

conductive fill via

Electronics Forum | Mon Nov 11 02:28:27 EST 2002 | Melvin

I want to make a double-sided PCB. the process include conductive filling via for RF guarding. Does anyone can tell me where I can do it?

conductive fill via

Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef

Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

BGA via in pad

Electronics Forum | Fri Mar 16 17:15:51 EDT 2007 | davef

Ask the board fabricator to: * Fill the vias with resin. * Then metalize and copper plate the filled via along with the pad. * Then plate with solderability protection. This results in what appears to be a solid pad. For more, look here: http://www

BGA via in pad

Electronics Forum | Thu Mar 15 13:27:45 EDT 2007 | Pete

We had a customer do a similar thing. We notified our customer and educated them on what was happening. We were instructed to try one and report on the results, as the vias were supposed to be filled (and weren't). We pasted and reflowed and as su

via in pad

Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef

Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

Re: via hole plugging

Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall

| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef

Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via

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