Electronics Forum | Wed Aug 22 16:23:06 EDT 2007 | rgduval
I had the lurching issue...turned out I needed to readjust to cog wheels on the exit side of the oven. The cogs had slipped, and the chain was actually getting caught in the teeth...to the point that as the wheel turned, the chain would stay in it i
Electronics Forum | Fri Aug 10 16:39:39 EDT 2007 | ratsalad
The parts libraries are not readable text. The Sanyo software we used (UCT, I believe) would optimize the program for you. NCZ format is different than the 4785 .800 format, but if you can understand the 4785 format you won't have any problems
Electronics Forum | Tue Aug 21 18:09:57 EDT 2007 | bentigano
Thanks vickt. I'll shoot them an email. I haven't had any luck ripping apart the central library file formats in the binary format. Hopefully the HSP techs can help me out. I was also told you can export components created on the machine, to the fl
Electronics Forum | Fri Aug 10 14:43:27 EDT 2007 | judym
When running some double sided reflow boards through the Heller oven, some of the caps/ res's are falling off the bottom side of the board. I understand if the parts are too heavy they wont stay in the molten solder, but these particular parts are no
Electronics Forum | Mon Aug 20 09:33:25 EDT 2007 | stepheniii
Your lighting would have to be pretty bad for it to be an issue. My gut instinct tells me you have bigger systemic issues. Operators will either be your best friend or your worst enemy. What percentage of boards have contamination? You might have t
Electronics Forum | Mon Aug 13 10:00:18 EDT 2007 | ed_faranda
Might want to check to see if the weight of your part has increased. If it has increased, you may not have enough surface tension to hold the part on the board. I am assuming you already checked that the component isn't getting hit by something in
Electronics Forum | Mon Aug 13 11:05:18 EDT 2007 | saaitk
Would I be correct in assuming that the solder used to attach the BGA ball to the device body should have a higher liquidous point that the solder used to attach the device to the board. If the peak reflow temp for SnPb is around 225 deg should the b
Electronics Forum | Mon Aug 13 22:39:36 EDT 2007 | davef
The solder used to attach the BGA ball to the BGA interposer would have a liquidous point dependent on the type of solder used by the device fabricator. If this is a lead free device [altho we don't think so], the solder used by the fabricator would
Electronics Forum | Tue Aug 14 09:17:59 EDT 2007 | bpan
What version AP are you using? What version windows are you using? I think that the results you are seeing may just be a bug in the software. Did you try to export the programs and look at them on the machine in central controller? Its been a while s
Electronics Forum | Mon Mar 10 16:25:53 EDT 2008 | alsnet
No problem.....Any time. Hello Everybody, I'm looking for the AutoProgram Software for Quad IIc machine, Do you know someone who can share me a copy of this?, I can share a copy of the technical manuals of this machine. If you're interested, plea
