Electronics Forum | Thu Jun 06 10:08:55 EDT 2013 | grauen06
We keep all moisture sensitive parts in a humidity control enviroment at our main plant, but our return/refurb products building does not have humidity control. My question: Do moisture sensitive ICs that get hand placed by our refurb/return team n
Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
Electronics Forum | Wed Jun 12 17:05:41 EDT 2013 | danselness
DeanM - thank you for your response. I will work on uploading a picture of the bridges. We are focusing our efforts on nine boards that use the TO-220 package. I will also pass along your idea of Oval Pads to our Manufacturing and Design Engineers
Electronics Forum | Fri Jun 07 13:34:48 EDT 2013 | dontfeedphils
Just looking to see what everyone out there is using as their CAM/Gerber and automated assembly programming software? I've worked with and am aware of CircuitCam and GC PowerPlace, are there any others out there that everyone is using or can recomme
Electronics Forum | Fri Jun 07 15:49:44 EDT 2013 | emeto
We use Circuit CAM. It is awesome tool, because it give us the possibility to do the model for the job with all the data inside and from there we can create our documentation, pick and place, SPI and AOI programs right away, because Circuit CAM gives
Electronics Forum | Fri Jun 14 10:07:34 EDT 2013 | dontfeedphils
Thanks for the input everyone. I'm leaning more towards either Aegis or Valor. The other two cheaper (or free) solutions seem to work alright, but I also have a system in place that works "alright". Investing time in half-measures is always a hard
Electronics Forum | Fri Jun 14 10:47:57 EDT 2013 | jax
If you are looking into Aegis and Valor, you should also look at Optimal (Optelco), and Cogiscan. All 4 can do what you want and offer a growth path into Mixed Equipment Programming, Scheduling, Traceability, Quality Tracking, etc... Depending on y
Electronics Forum | Tue Jun 11 06:24:07 EDT 2013 | trottmann
thanks. 1. yes, i understand this requires SMT > assembly. > > 2. For bigger components (USB and > phone jack), how can these be placed > automatically on PCB? The manual process will be > slow. Hello, Use "THR Through-Hole-Reflow" also calle
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi