Electronics Forum | Wed Aug 26 05:22:59 EDT 2009 | grahamcooper22
Hi Sergey, I agree with your probable cause. Maybe if you still have a component you can bake it before reflow to DRY it. Then if the problem doesn't happen in reflow you have surely proved the cause. Consult IPC JEDEC 33B spec for storage and Drying
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Wed Aug 19 15:24:21 EDT 2009 | smt_guy
I have a customer who approved and asked us to process PCB's built with Lead-Free HASL Finish using Eutectic Solder. We did as directed and inspected the result from a 10-PCB Run and couldn't find any problem with solderability or issues. What Issue
Electronics Forum | Wed Aug 19 16:01:47 EDT 2009 | davef
You say, "using Eutectic Solder." * There are lots of eutectic solders. * When melted, a eutectic solder goes directly from a solid to liquid phase with no pasty phase. Do you mean 63/37 tin lead solder? If so, probably your assembly won't be RoHS
Electronics Forum | Wed Aug 19 18:18:02 EDT 2009 | smt_guy
Thanks Sir Dave. Yeah my apologies. To clarify, we built the product PCB whcih has a Lead-Free HASL Finish using a Sn63/Pb37 Solder paste. My major concern regarding reliability is that my profile whish is between 215'C-225'C was insufficient to ref
Electronics Forum | Mon Aug 24 11:17:19 EDT 2009 | stepheniii
Don't make that assumption. Once we had concerns about PCB's not matching what was ordered. I said "if we got HASL instead of ENIG, how do we know we got lead-free?" I mean if one thing got mixed up in translation, maybe two did. So we put a bare P
Electronics Forum | Thu Aug 20 00:16:56 EDT 2009 | padawanlinuxero
Hello I am having a problem with the flux in the wave solder, I am using a sonoflux 9000 this machine uses a air knife to spray the flux, it creates a mist that when hits the air knife pulls the mist up to the pallet where the board is, but for som
Electronics Forum | Thu Aug 20 13:15:58 EDT 2009 | ratsalad
Yes, you should be able to. The feeder interface for the GSMs (not Advantis or Genesis) has been the same as far back as I can remember... And we used to have a D-block machine. We use some of the same feeders from that old D-block GSM on the GSM
Electronics Forum | Sat Aug 22 15:12:32 EDT 2009 | rossi
Thank you for replying. 1) the finish is Gold Immersion (ENIG) 2) paste type EM907 SN96.5/AG3.0/CU0.5 3) it is always the same BGA but its not on the same ball every time. It is always at the joint on the PCB pad like the solder is not sticking prope
Electronics Forum | Mon Aug 24 10:35:54 EDT 2009 | rossi
I don't think its an issue with the PCB. When we just put the paste down and not the BGA the solder paste seems to adhere to the PCB pads very well (not brittle). Also we have other very similar PCBs that we run different normal silver content BGAs
