Electronics Forum: viewed (Page 7061 of 7930)

Pad finish

Electronics Forum | Wed Oct 06 04:11:35 EDT 2010 | grahamcooper22

I've done minimal research to this point and > understand my issue with solder on the double > sided boards is due to oxidation that occures on > the unpopulated pads when the board makes its > first trip through the reflow oven. > > We did run

Pad finish

Electronics Forum | Thu Oct 07 08:13:52 EDT 2010 | remullis

I just swapped from the HASL to Immersion Silver mainly because the board house we use could not maintain consistency in keeping the pads level. I was constantly battling bumps and bad finishes on the pads. They are able to give me a consistent board

ENIG Solderability Issues

Electronics Forum | Thu Sep 30 16:28:51 EDT 2010 | 18424

Hello All, looking for some help from you guru's. I have several Enig boards with solderability problems. Components ranging from 0402's to ssop's. Using AIM W/S leaded solder paste, profile is beautiful and has been for years running the same produc

Westek SMT IV Drying Question

Electronics Forum | Mon Oct 04 10:02:09 EDT 2010 | babe7362000

I have a question about Drying a PCB after it goes thru the washer. Just wondering if others have to dry components off using air at the end of the wash? Our current process is that we wash the boards and dry certain parts off with the air hose aft

Seeking AXI machine

Electronics Forum | Wed Oct 13 06:20:00 EDT 2010 | costache

Dear All > > I need to check the solder paste > volume inside the PTH at our board,which size is > 440x620 mm.So, I may need 3D inspection > machine,AXI, not AOI.So, does anyone recommand me > which 3D machine is suited to my PCB? Thanks in > a

SMT line design_suggestion please

Electronics Forum | Fri Oct 08 06:54:04 EDT 2010 | plruzza

My factory is in front of establishing SMT production line. I have difficult task to select what machines we will buy. Unfortunatelly I don't have enough experience because so far we had through holes production only. On the market exist many produce

Dust Level of SMT Floor

Electronics Forum | Tue Oct 12 09:52:18 EDT 2010 | dyoungquist

Obviously a totally clean floor is the best. So what if you have 1 particle of dust on your entire production floor? Is that 1 part per million (1 PPM)? or is that 1 part per billion? or 1 part per ???? How do you measure dust and come up with a

ROHS 6/6 BGA device in Non-ROHS reflow

Electronics Forum | Thu Oct 14 09:33:10 EDT 2010 | sachinnalbalwar

Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment. I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is availab

ROHS 6/6 BGA device in Non-ROHS reflow

Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon

Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your

Selective Soldering - Barrel Fill

Electronics Forum | Fri Oct 22 19:34:56 EDT 2010 | hegemon

Thanks for the help guys. Nice to think I was basically on the right path. PCB manufacturer has finally conceded the barrel defects and is remaking the PCBs. We are big on pre-tinning the leads of TH connectors as well as providing some good pre


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