Electronics Forum | Mon Apr 18 20:44:30 EDT 2005 | davef
Charly: Why do you "need to bake the PCb due to moisture issue", if you're not going to use the board? Why bake the board, just to put it back in storage, absorb moisture, and require baking again?
Electronics Forum | Wed Apr 20 01:08:16 EDT 2005 | charly
actually, i received a shipment from supplier where the vacuum seal was puntual and the HIC is out of order, the supplier ask me to bake and keep back into the store, but i worry is there any quality impact if i do so?
Electronics Forum | Wed Apr 13 08:56:39 EDT 2005 | Dhanish
Hi, I need help as we are seeing high defect on label peeling off which is attached on the PCB.After remove the liner on the Lexan label,we realize there is crack in the adhesive and base materialPlease advise what test can be done to ensure there is
Electronics Forum | Wed Apr 13 13:29:16 EDT 2005 | russ
Are you saying that the component is on pad before the oven and then off after reflow? Also please tell us what the package is QFP, BGA, ?
Electronics Forum | Wed Apr 13 14:54:21 EDT 2005 | vikkaraja
It is QFP 208 legs. I have sat by the machine for hours and did not see a problem before the oven. I walk away from it and get a call again.
Electronics Forum | Thu Apr 14 10:41:54 EDT 2005 | vikkaraja
No, there is no operator sitting before the oven inspecting the boards. Like I said this problem is so random, sometime I do not hear from production for days. Then there are days more than once a day it happens. We are using
Electronics Forum | Thu Apr 14 11:38:29 EDT 2005 | mmjm_1099
Play around and setup the coplanarity in Fuji Flexa and see if this can help you at all. Other than that I wouldn't have a clue as to what it might be.
Electronics Forum | Thu Apr 14 12:33:30 EDT 2005 | russ
Have you checked the component height in the package data to ensure that it is the same? how about the PCB itself, could there be some warp or twist thay may cause the component to be dropped onto the board? any support problems? this is all I can
Electronics Forum | Fri Apr 15 11:52:09 EDT 2005 | vikkaraja
Part is being pre rotated already and I also changed the nozzle size from 15mm to 17.5mm this morning. There is no board warpage at all and production is watching for it while an operator puts on a barcode label.
Electronics Forum | Fri Apr 15 11:54:10 EDT 2005 | vikkaraja
I did not think about it, but next time I get call back again for this problem. I would definatly look into it.
