Electronics Forum: viewing (Page 2736 of 7929)

cab Maestro 2M De-Panelizer

Electronics Forum | Tue Dec 23 10:32:11 EST 2008 | muarty

D.A.T.E. electronic supplies supply spare parts for all Cab Maestro depanelling

BGA, ERSA, Why tem goes 300'c by itself when power on.

Electronics Forum | Wed Dec 17 08:43:14 EST 2008 | stiva

Have seen this problem on other types of oven and it was caused by failed solid state relays that energise the heaters.

Replating a Gold Connector

Electronics Forum | Mon Dec 15 12:42:18 EST 2008 | bandjwet

Dear Smtnetters: We have a customer wanting to strip off or overplate a gold microplated connector with tin (gold disposal too difficult) . Does anyone know if this is feasible? Regards BWET

MID assembly

Electronics Forum | Tue Dec 16 06:59:47 EST 2008 | janz

Hello, I am looking for technical papers (tips, tricks. machines, materials etc) for MID assembly (Moulded Interconnect Device - 3D assembly). Regards Janz

flame retardant deca-BDE ban

Electronics Forum | Tue Dec 16 17:07:46 EST 2008 | stepheniii

NEW ban proposal? It was exempted from ROHS and that exemption was lifted during the summer. I made a post about it no longer being allowed back in July. Here's a link I posted. http://www.rsjtechnical.com/NewsDecaBDE.htm

flame retardant deca-BDE ban

Electronics Forum | Wed Dec 17 11:28:22 EST 2008 | patrickbruneel

Stephen, You're absolutely correct I totally miswrote the post. What I wanted to highlight is the efforts from the reachforlife organization. Decision making should be based on scientific evidence. http://www.reachforlife.eu/home.php?lg=UK

Adhesive printing parameters

Electronics Forum | Wed Dec 17 11:25:38 EST 2008 | davef

dots of minimal height. So, use a lower viscosity adhesive. * Higher standoff components => larger (and taller) dots. So, use a high viscosity [typically, also high yield point] adhesive.

Adhesive printing parameters

Electronics Forum | Wed Dec 17 13:25:38 EST 2008 | evtimov

I am printing on DEKs and using simulara paramateres as for a solder it works really fine. In general going faster gives you more paste/glue. Less pressure gives you more paste/glue again. All the rest depends on your current board. Regards, Emil

Adhesive printing parameters

Electronics Forum | Wed Dec 17 13:34:15 EST 2008 | jorge_quijano

Ok, thanks for the info, fortunatelly we already have our Camalot glue dispenser machine In-line with our MPM, for helping whit the high stand-off components.

EDA/CAMTutorial free download!!!

Electronics Forum | Thu Dec 18 21:09:06 EST 2008 | cadfamily

Welcome to http: //www cadfamily com supply EDA/CAM Learning Tutorial free download!!! For example:Mentor Graphic,Cadence,PowerPCB,PADS,ORCAD,AGILENG,ANSOFT,SYNOPSYS,ZUKEN,GENESIS,VA LOR,UCAM,PARCAM,VXWORKS,TONARDO,ACTEL,ACTIVE-HDL,FPGA ETC.


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