Electronics Forum: viewing (Page 4511 of 7929)

Leadfree Production experiences so far

Electronics Forum | Mon Jan 08 12:37:30 EST 2007 | aj

Hi all, I posted a thread a while back looking for information from other Engineers regarding how they felt the whole "RoHS Compliance Introduction" had gone. I cant locate the thread - if anyone could add their experiences to this thread I would

manufacture symbols

Electronics Forum | Tue Jan 09 22:16:17 EST 2007 | guest

For chip components it is very hard to identify specially the capacitors. You could get sample of each chip manufacture and compare the color. This is very labor intensive task. I suggest to sort by value ( capacitance, resistance) than by manufac

Counterbore a bare hole

Electronics Forum | Tue Jan 09 11:25:45 EST 2007 | gerryb

Because of some mechanical issues we believe that we need to counterbore 2 holes on one of our 2.4mm pcbs. We want to counterbore to a 0.5mm depth. The unplated hole is 4mm diameter and the counterbore diameter is 7.5mm. We have never done this befor

Problem with shielding component

Electronics Forum | Tue Jan 09 22:33:45 EST 2007 | Guest

Dear AJ, Try removing shield ,test it, verify if it would perform as the previous runs . If not, there maybe something wrong with device or as one of our collegue mentioned that there is possibilty the your customer change some components.If the

Problem with shielding component

Electronics Forum | Wed Jan 10 09:57:08 EST 2007 | realchunks

Shields can carry a large thermal mass. If you ever tried removing one in repair, you'd find out how hard they can be. Also, they do deflect air flow. So in a convection oven, your air flow will be turbulent, which also will affect your reflow.

Problem with shielding component

Electronics Forum | Wed Jan 17 10:14:37 EST 2007 | slthomas

2-3mm would seem close enough to affect the air flow and I was thinking it could be displacing the qfn. However, if you ran a failed board back through reflow and it was functional after that, I'd put my money on insufficient reflow. I suppose it's

Problem with shielding component

Electronics Forum | Fri Jan 19 13:31:14 EST 2007 | lit51

Is the failure just out of tolerance or is it non functioning? For tolerance problem, compare the x-rays of the good and bad units. It will take a very high resolution x-ray to spot the differences. Changes in capacitance values can occur based on

Indium Solder Hermetic Seal Voiding

Electronics Forum | Thu Jan 11 09:23:32 EST 2007 | mscalzo3

BE, Flux coating helps as there is no solvent to volatize. Also, we offer vacuum-cast preforms that will eliminate the possibility of the voids comimg from the alloy itself. I can email a PDF of some profiles, all I need your email address. You c

Indium Solder Hermetic Seal Voiding

Electronics Forum | Thu Jan 11 22:15:27 EST 2007 | behrsam

it's a vacuum dewar so adhesives will eventually permeate and the vacuum would be lost. Sounds to me since I have the N2 capability, I definately should try it. I am obtaining Indium Flux and Solvent so I can adjust the activity when I start using

Solder reflow temperatures too high

Electronics Forum | Thu Jan 11 16:01:52 EST 2007 | russ

You using lead free BGAS now? What is your rework equipment and process? I am sure we can help you out here with some more detail, you should get the package data sheets for your problem BGAs and determine ball alloy or they may even be CCGA packag


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