Electronics Forum | Wed Aug 20 08:05:06 EDT 2008 | pjc
They are faster today, but still not up to fixed-pin machine speeds. They tend to be 7x to 10x slower. Any of the machine suppliers can run a test evaluation and give you a report on test coverage and test times. There are techniques to make them fas
Electronics Forum | Mon Aug 11 08:56:28 EDT 2008 | ethancw1sel
The technical support department at Hover-Davis has been very supportive in getting our issues cleared up. And they continue to be so. I was just trying to guage other operators trends with them. I believe we own some odd 600 feeders of various si
Electronics Forum | Fri Aug 08 16:55:20 EDT 2008 | thaqalain
On a specific shop order we face the trouble of wrong polarity for LINEAR VOLT REG. This is happened b/c components were situated diagonally opposite way in the reels. Here are suppier details: ST MICROELECTRONICS P/N: L5973D013TR Can we leave b
Electronics Forum | Mon Aug 11 08:47:31 EDT 2008 | davef
Your MPI (Inspection Procedure) is certainly flawed. Your MPI should have caught this on the first board your produced, before it was reflowed. For help convincing yourself the part is rotated 180*, your choices are: * Get the pin-out of the compone
Electronics Forum | Mon Aug 11 11:13:05 EDT 2008 | davef
So, how did you get some parts going one way and other parts going another way? It would be highly unusual to receive a reel packaged that way. No, don't send the data sheet. We can see that Vcc is on pin 8 of the part. What pin of this component do
Electronics Forum | Mon Aug 11 07:27:32 EDT 2008 | eyalg
We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress wa
Electronics Forum | Mon Aug 11 10:45:04 EDT 2008 | eyalg
I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA. hi I mean that the the balls were left on the board and the BGA pads were found clean. What do you
Electronics Forum | Mon Aug 11 10:47:40 EDT 2008 | dphilbrick
Sounds like bad BGA's to me. I suspect this is rare but you can get black pad on the BGA attach pads just like you get them on a PCB. Do you have un-processed BGA's?(still in package) I would have one tested (not by the manufacturer)!
Electronics Forum | Mon Aug 11 10:35:32 EDT 2008 | realchunks
What does your top side wetting look like? This is a perfect case where top side wetting will tell you when you have a good joint. Without seeingor knowing your process, I would suggest either more pre-heat or longer dwell in the solder. Either on
Electronics Forum | Tue Aug 12 08:35:28 EDT 2008 | avalancher
Many years ago... my old engineer used a very simple unit bought at Radio Shack. It was a device that they use in door ways to announce someone was entering the store. It used a beam of light and when the board broke that beam, a bell/ring/noise wou
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