Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Mon Aug 26 23:35:08 EDT 2002 | Dave
Hey there, we use... Hmmms... we use a 6 hour paste I think from sci-tech or something that sounds like that, ws160a. as a rule what I paste up first thing, I want in the oven just after lunch, so about 4-5 hours. anything over that and your playin
Electronics Forum | Mon Aug 26 09:50:32 EDT 2002 | zanolli
I want to ascertain the oven profile required for through hole connectors with solder pre-forms. I need to get double sided PCB�s made for that purpose. What is the best way to get these PCB�s made to simulate real world conditions?. Should I leave a
Electronics Forum | Mon Sep 09 13:46:34 EDT 2002 | dragonslayr
Your lack of obvious solder balls indicates you have a decent process. However, there are still small solder balls that are free and floating on the surface of the boards prior to wash. That same solder ball is washed off and ends up in the wash solu
Electronics Forum | Thu Aug 29 20:15:26 EDT 2002 | davef
That you are getting BIG gobs of solder on the pads indicates that your print / paste process is probably OK. Sounds like someone did something bad to the OSP. Tell us about: * Supplier and brand of OSP that your board fabricator used. * Number of
Electronics Forum | Fri Aug 30 16:35:05 EDT 2002 | davef
Oooo, I get it. Sorry I am so dense. So, as Johnny Cochran might say, your pads are so slick that the paste won�t stick. So, either: * Someone is slimming your boards with goop that prevents the paste from sticking on the pads. Some plastic bag h
Electronics Forum | Fri Aug 30 22:20:27 EDT 2002 | lysik
265 is a great unit. Your process should be OK. I am sorry I asked you to check it I just wanted to start with the basics. I am at a loss. May be a bad batch of paste. I am reaching for straws. I know it sounds crazy but try a really slow (snap off)
Electronics Forum | Tue Sep 03 00:03:00 EDT 2002 | TLe
Thanks Guys, I agree, you have to start with basics. Tri Jet, you have a point there: " art not not a science". Basically, it is a simple process. Maby that is why we "rocket scientists" try to get far-fetched answers to our process challenges, it
Electronics Forum | Wed Aug 28 03:16:14 EDT 2002 | bentzen
Hi. I have a huge problem with Fuji CP643 recognition of 0603 (1608) capacitors from PhyComp. The terminations appear round with no clear corner edges. I have used vision type 10 but also tried others without luck. For certain parts I have 10 - 20 %
Electronics Forum | Wed Sep 11 01:05:02 EDT 2002 | Brian Sloth Bentzen
Hi Again. It's funny, but the Fuji manual "SMD3 Vision Processing Referance Manual - REF-SMD3-2.0E" discribe specifically that for vision type 11 and 12 the nozzle should not protrude from the component. I believe that it should be correct then! As
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