Electronics Forum: viewing (Page 5521 of 7929)

OSP / Paste Printing Problems

Electronics Forum | Fri Aug 30 22:20:27 EDT 2002 | lysik

265 is a great unit. Your process should be OK. I am sorry I asked you to check it I just wanted to start with the basics. I am at a loss. May be a bad batch of paste. I am reaching for straws. I know it sounds crazy but try a really slow (snap off)

OSP / Paste Printing Problems

Electronics Forum | Tue Sep 03 00:03:00 EDT 2002 | TLe

Thanks Guys, I agree, you have to start with basics. Tri Jet, you have a point there: " art not not a science". Basically, it is a simple process. Maby that is why we "rocket scientists" try to get far-fetched answers to our process challenges, it

Poor Fuji recognition of PhyComp 0603 (1608) cap

Electronics Forum | Wed Aug 28 03:16:14 EDT 2002 | bentzen

Hi. I have a huge problem with Fuji CP643 recognition of 0603 (1608) capacitors from PhyComp. The terminations appear round with no clear corner edges. I have used vision type 10 but also tried others without luck. For certain parts I have 10 - 20 %

What color was the towel?

Electronics Forum | Wed Sep 11 01:05:02 EDT 2002 | Brian Sloth Bentzen

Hi Again. It's funny, but the Fuji manual "SMD3 Vision Processing Referance Manual - REF-SMD3-2.0E" discribe specifically that for vision type 11 and 12 the nozzle should not protrude from the component. I believe that it should be correct then! As

Poor Fuji recognition of PhyComp 0603 (1608) cap

Electronics Forum | Wed Sep 11 01:17:59 EDT 2002 | Brian Sloth Bentzen

Hi Steve. My Fuji CP6 is model 643 and are 3 years old, maintained and upgraded with the newest software along the way. And, actually it was Fuji Japan that gave in, not Fuji America. Fuji Japan tested our components and found the same problem and

BGA & PCB - solderability issue

Electronics Forum | Thu Aug 29 07:46:39 EDT 2002 | nifhail

Hello Experts We ran into problem today when one of the board that we assembled having problem at Test, BGA failure. The joints looks good but no continuity. When trying to remove the BGA, i found that the pad on the PCB is intact but black in colou

Bottom side SMT wave vs. top side reflow yields

Electronics Forum | Thu Aug 29 12:48:26 EDT 2002 | slthomas

Assuming all things are equal (attention to good DFM guidelines, well trained and capable operators, well maintained equipment, etc.), which would you expect to have the higher process yield, standard SMT/through-hole all topside, or all SMT bottom (

Bottom side SMT wave vs. top side reflow yields

Electronics Forum | Fri Aug 30 17:33:20 EDT 2002 | slthomas

Thanks, guys. Hi Larry, long time no "see". Dave, 60k dots out of a Camalot 2800 does not a "Dispenser Boy" make. :P I'd print them in a heartbeat if the proximity to radial leads didn't necessitate me placing radials first. Oh, wait, I'd have to

imm. silver

Electronics Forum | Thu Aug 29 17:51:43 EDT 2002 | nifhail

I have seen several Imm Ag pad on the assembled board which have a copper colorleaching through the silver plating This happened on the pad which was not deposited with paste during the assembly process. Don't know if it is a problem, but we only h

reply, wave vs. reflow SMT yields

Electronics Forum | Fri Aug 30 17:39:34 EDT 2002 | slthomas

Can't seem to get a reply through (watch, they'll all show up in about 15 minutes), so I'll try this. Thanks guys. Hi Larry, long time no talk to. "Dispenser Boy"???!! If they wanted me to build them (instead of the overseas CM) I'd print them my


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